Waveguide-Packaged MicroLED Links for Low-Power Chip Interconnects
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Solution Overview
Problem
Current electrical interconnects in multi-chip modules are limited by parasitic resistance, inductance, and capacitance, which restrict the number of integrated circuits that can be combined and increase power consumption, especially at high data rates, due to wiring density constraints.
Innovation Solution
The implementation of optical links using microLEDs, which reduce the need for serializer-deserializers and lower power consumption by employing dense arrays of optical connections in 2D or 3D formats, with microLEDs encapsulated in waveguides and reflectors to enhance light transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical interconnects are used to connect multiple ICs in multi-chip modules, then data communication between chips is achieved, but parasitic resistance, inductance, and capacitance increase, limiting the number of ICs that can be combined and increasing power consumption
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution eliminates the parasitic resistance, inductance, and capacitance inherent in electrical wiring, thereby reducing power consumption and enabling higher data rates without the energy losses associated with traditional electrical connections.
Solution Approach 2:
The patent introduces waveguides as intermediary structures to transmit optical signals between microLEDs and photodetectors. These waveguides provide a dedicated optical transmission path that replaces electrical wiring, enabling efficient light transmission while eliminating the parasitic effects of electrical interconnects.
2Productivity
If wiring density is increased to connect more ICs, then the number of ICs that can be combined increases, but parasitic effects worsen and additional power is consumed in SERDES
Solution Approach 1:
The patent replaces dense electrical wiring with optical interconnects using microLEDs and waveguides. This substitution eliminates the need for high-density electrical wiring and complex SERDES circuits, reducing both wiring density and device complexity while enabling more ICs to be combined in the multi-chip module.
3Loss of energy
If chips are mounted very close to each other to reduce parasitic effects, then parasitic resistance, inductance, and capacitance are reduced, but the number of ICs that can be combined is limited
Solution Approach 1:
The patent introduces waveguides as intermediary optical transmission paths between microLEDs and photodetectors. These waveguides enable optical signal transmission without requiring chips to be mounted extremely close together, as the optical signals can travel through the waveguide structure with minimal loss, thereby reducing parasitic effects while allowing greater spatial separation between chips.
4Speed
If data rate per lane is increased to reduce the number of lanes, then communication speed improves, but parasitics become worse and additional power is consumed in SERDES
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission using microLEDs and photodetectors. This substitution eliminates the need for SERDES circuits and their associated power consumption, enabling high data rates without the energy losses and parasitic effects that plague high-speed electrical interconnects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high data rates with reduced parasitic limitations and electrical crosstalk, allowing for more integrated circuits to be connected without the constraints of traditional electrical interconnects, while maintaining lower power consumption.
Implementation Method 1
an optical source, such as a microLED
Implementation Method 2
a first waveguide optically coupling the first microLED and the first photodetector
Implementation Method 3
a first photodetector; first amplification circuitry for amplifying signals from the first photodetector
Data Source
AI summary
A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.