Waveguide Optical Module Layout for Pre-Tested High-Yield Assembly
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Solution Overview
Problem
The yield of optical modules decreases when the number of components mounted on the wiring substrate increases due to defects detected during operational tests after components are assembled.
Innovation Solution
The optical module design includes a waveguide component with integrated photonic and electrical integrated circuit elements, allowing for pre-assembly testing to ensure non-defective components are mounted on the wiring substrate, and a structure that minimizes wiring length and heat accumulation, enhancing electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are mounted on the wiring substrate, then the functionality of the optical module is improved, but the yield decreases due to defects detected during operational tests
Solution Approach 1:
The patent segments the optical module into a wiring substrate and a separate waveguide component. The waveguide component integrates the optical waveguide, photonic integrated circuit element, and electrical integrated circuit element in a modular structure. This segmentation allows the waveguide component to be tested independently for optical and electrical defects before being mounted on the wiring substrate, thereby maintaining high yield while achieving complex functionality through modular integration.
2Adaptability or versatility
If multiple components are mounted on the wiring substrate, then the functionality of the optical module is improved, but the number of mounting positions increases making assembly more difficult
Solution Approach 1:
The patent merges the optical waveguide, photonic integrated circuit element, and electrical integrated circuit element into a single integrated waveguide component. This consolidation reduces the number of separate components that need to be mounted on the wiring substrate from multiple individual mounts to a single waveguide component mount, significantly simplifying the assembly process while maintaining all necessary optical and electrical functionalities.
3Reliability
If components are arranged to minimize wiring length, then electrical characteristics are improved, but the layout complexity increases
Solution Approach 1:
The patent transitions the arrangement of optical and electrical elements from a two-dimensional planar layout on the wiring substrate to a three-dimensional vertical stacking configuration within the waveguide component. The optical waveguide, photonic integrated circuit element, and electrical integrated circuit element are stacked vertically, allowing direct optical and electrical coupling with minimal wiring length. This vertical integration reduces the wiring length and improves electrical characteristics without increasing layout complexity, as the compact stacked structure eliminates the need for complex lateral routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains high yield by identifying defects before assembly, reduces high-frequency loss, improves transmission quality, and minimizes heat accumulation, while maintaining compact size and electrical efficiency.
Implementation Method 1
The waveguide substrate includes an optical waveguide, a first surface, and a second surface opposite the first surface
Data Source
AI summary
An optical module includes a wiring substrate, electronic components mounted on the wiring substrate, and a waveguide component mounted on the wiring substrate and connecting the electronic components to each other. The waveguide component includes a waveguide substrate including an optical waveguide, a first surface, and a second surface opposite the first surface. A photonic integrated circuit element is mounted on the first surface of the waveguide substrate and optically connected to the optical waveguide. An electrical integrated circuit element is mounted on the second surface of the waveguide substrate and electrically connected to the photonic integrated circuit element.