Optical Waveguide Package Sealing for Airtight, Low-Deformation Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical waveguide packages face challenges in achieving gas-barrier performance and airtightness while maintaining efficient electrical connections and reducing module size and thermal deformation.
Innovation Solution
The optical waveguide package incorporates a gas-barrier thin film and a gas-barrier cap with an inorganic material layer, eliminating organic material layers to create a sealed airtight space, and uses metal members with strategic placement to minimize thermal deformation and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate mounting steps are used for VCSEL array and photodetector array, then alignment precision can be improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges the VCSEL array mounting and photodetector array mounting into a single simultaneous operation. Both arrays are mounted to the same substrate in one step, eliminating the need for separate mounting processes while maintaining alignment precision through the shared mounting architecture.
Solution Approach 2:
The patent segments the mounting substrate into distinct regions with different refractive indices - a first region for VCSEL arrays and a second region for photodetector arrays. This segmentation allows each array type to be optimized for its specific function while being mounted simultaneously in a single operation.
2Manufacturing precision
If multiple mounting steps are used for different arrays, then alignment accuracy can be improved, but production efficiency decreases
Solution Approach 1:
The patent combines multiple mounting operations into a single simultaneous mounting step. The VCSEL arrays and photodetector arrays are mounted to the substrate at the same time using the same mounting structure, which eliminates sequential processing steps and improves production efficiency while maintaining alignment accuracy.
Solution Approach 2:
The patent incorporates alignment marks and positioning structures into the substrate design before the mounting process. These pre-built features guide the simultaneous mounting operation, ensuring high alignment accuracy is achieved in a single step without requiring multiple iterative adjustments.
3Reliability
If different mounting substrates are used for VCSEL and photodetector arrays, then optical coupling can be optimized, but device complexity increases
Solution Approach 1:
The patent applies local quality by creating distinct regions within a single substrate - a first region with specific refractive index properties for VCSEL arrays and a second region with different properties for photodetector arrays. Each region is optimized for its specific optical coupling requirements, achieving high reliability without requiring entirely separate substrates.
Solution Approach 2:
The patent makes a single substrate perform multiple functions by incorporating both VCSEL array mounting and photodetector array mounting capabilities into one structure. The substrate serves as both the mounting platform for light sources and the mounting platform for detectors, while also providing optical coupling functionality through its refractive index properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves enhanced gas-barrier performance, airtightness, reduced module size, and improved thermal stability, while maintaining efficient electrical connections and heat dissipation.
Implementation Method 1
the substrate configured to direct light from the VCSEL array to the photodetector array
Implementation Method 2
direct light from the VCSEL array through the substrate to the photodetector array
Data Source
Figure 1~2
Figure 3~4A
Figure 4B~5A
AI summary
An optical waveguide package includes a substrate including a first surface and a second surface opposite to the first surface, a cladding located on the second surface and including a third surface facing the second surface, a fourth surface opposite to the third surface, and an element-receiving portion with an opening in the fourth surface, a core located in the cladding and extending from the element-receiving portion, and a first metal member located in the element-receiving portion in a plan view as viewed in a direction toward the fourth surface and including an element mount. The first metal member is connected to a second metal member with a first via conductor extending through the substrate from the first surface to the second surface.