Waveguide Antenna Package Alignment to Prevent Lamination Shift
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Solution Overview
Problem
Current hybrid antenna-in-package (AiP) structures face lamination shift issues when integrating heterogeneous materials, leading to reduced radiation gain due to complex manufacturing processes and alignment challenges between the antenna and feeding elements.
Innovation Solution
A semiconductor device package design that includes a substrate with a waveguide component aligned with a feeding element and an antenna pattern, where the waveguide component is partially disposed over the substrate and encapsulated, mitigating lamination shifts by ensuring precise alignment and reducing radiation losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If selective molding operations are used to integrate heterogeneous materials, then the antenna-in-package structure can be formed, but lamination shift issues occur and manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the antenna pattern and feeding element on the substrate before integrating the waveguide component. This ensures that the antenna and feeding elements are precisely aligned from the outset, eliminating lamination shift issues that would otherwise occur during subsequent molding operations. The substrate is prepared with all critical alignment features in place before the encapsulation process begins.
2Adaptability or versatility
If complex manufacturing processes with selective molding are used, then heterogeneous materials can be integrated, but device complexity increases
Solution Approach 1:
The patent merges the antenna pattern, feeding element, and waveguide component into a single integrated structure on the substrate. By combining these elements that would otherwise require separate molding operations and alignment steps, the manufacturing process is simplified while still achieving integration of heterogeneous materials. The waveguide component is directly coupled to the feeding element on the same substrate, eliminating the need for complex multi-step molding processes.
3Adaptability or versatility
If lamination shifts occur during manufacturing, then heterogeneous materials can be integrated, but radiation gain is reduced
Solution Approach 1:
The patent prevents radiation gain loss by performing preliminary alignment of the antenna pattern and feeding element on the substrate before waveguide integration. This preliminary action ensures that the critical alignment between antenna and feeding element is established before any encapsulation or molding operations, thereby preventing lamination shifts that would cause misalignment and reduce radiation gain.
Solution Approach 2:
The patent converts the potential harm of lamination shifts into a benefit by using the substrate as a stable reference plane that inherently prevents misalignment. The substrate serves as a rigid foundation that maintains precise spatial relationships between all components, transforming what would be a source of alignment errors into a guarantee of alignment precision, thereby maximizing radiation gain.
Data Source
AI summary
The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.