Waveguide Package Structure for High-Speed Die-to-Antenna Signaling

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Solution Overview

Problem

Existing semiconductor device packaging technologies face challenges in efficiently integrating and connecting semiconductor dies with redistribution circuit structures while ensuring reliable signal transmission and thermal management.

Innovation Solution

A manufacturing method involving a carrier with a debond layer, redistribution circuit structures, through vias, and waveguide structures that facilitate electrical and thermal connections, enabling efficient signal transmission through electromagnetic wave propagation and enhanced thermal dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If conventional packaging technologies are used to integrate semiconductor dies with redistribution circuit structures, then manufacturing simplicity is maintained, but signal transmission speed and thermal management efficiency deteriorate

Engineering Contradiction:

Improvesignal transmission speedVSAvoidpackage structure complexity

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The patent transitions from conventional planar packaging to a three-dimensional stacked architecture where semiconductor dies are vertically positioned above substrate structures. This vertical stacking enables simultaneous achievement of high-speed signal transmission through shortened interconnect paths and effective thermal management through dedicated thermal vias conducting heat to heat sinks, without proportionally increasing device complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The package structure is segmented into functionally distinct layers: signal transmission layers containing redistribution circuit structures and via structures for electrical connections, and thermal management layers containing thermal vias and heat sinks. This segmentation allows independent optimization of signal integrity and thermal dissipation, resolving the contradiction between transmission speed and structural complexity.

Inventive Principle:

Principle #1Segmentation

2Temperature

If complex packaging structures are implemented to improve thermal management, then thermal dissipation efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The via structures serve dual functions: electrical via structures conduct signals between layers while thermal via structures conduct heat away from active devices. By using the same basic via formation process for both electrical and thermal connections, the patent achieves multi-functionality without proportionally increasing manufacturing complexity, as the fundamental fabrication steps remain consistent across different via types.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If conventional connection methods are used between semiconductor dies and redistribution circuits, then ease of connection is maintained, but signal transmission quality and thermal management deteriorate

Engineering Contradiction:

Improveconnection reliabilityVSAvoidconnection structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Redistribution circuit structures act as intermediary elements between semiconductor dies and external connections. These intermediate circuit layers provide both electrical signal routing and thermal conduction pathways, enhancing connection reliability by separating the die from direct external connections while improving signal integrity and heat dissipation without requiring complex direct bonding structures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances signal transmission speed and reduces electromagnetic interference, while improving thermal management and reliability of the package structure.

Implementation Method 1

wherein the second redistribution circuit structure is located between the antenna and the at least one semiconductor die, and the antenna is electrically communicated with the at least one semiconductor die through the at least one waveguide structure

Methodology Applied

Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

improving thermal management and reliability of the package structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250343178A1Package structure and manufacturing method thereof

Publication Date: 2025.11.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. The waveguide structure is located aside and electrically coupled to the semiconductor die, wherein the waveguide structure includes a part of the first redistribution circuit structure, a part of the second redistribution circuit structure and a plurality of first through vias each connecting to the part of the first redistribution circuit structure and the part of the second redistribution circuit structure. The antenna is located on the semiconductor die, wherein the second redistribution circuit structure is sandwiched between the antenna and the semiconductor die, and the antenna is electrically communicated with the semiconductor die through the waveguide structure.