Optical Waveguide Package Sealing With Protrusion Bonding
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Solution Overview
Problem
Existing light-emitting devices face issues with airtightness due to thermal expansion differences between the cladding, lid, and bond, caused by temperature variations across the device.
Innovation Solution
The light-emitting device incorporates a cladding structure with first and second portions having different thermal expansion characteristics, featuring protrusions on the third surface to increase the bonding area between the lid and cladding, thereby enhancing adhesion and reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding area between lid and cladding is increased to improve adhesion, then bonding strength improves, but thermal stress from thermal expansion differences increases
Solution Approach 1:
Instead of uniformly increasing the bonding area across the entire lid-cladding interface, the invention concentrates additional bonding area at specific protrusion locations. This local quality enhancement provides stronger adhesion where needed while leaving other areas with smaller bonding zones that can better accommodate thermal deformation, thus reducing overall thermal stress.
Solution Approach 2:
The bonding area is divided into multiple discrete protrusion elements rather than a single large continuous bond. Each protrusion acts as an independent bonding unit that can deform locally to accommodate thermal expansion, preventing the accumulation of stress that would occur in a large continuous bonding zone.
2Device complexity
If a flat bonding surface is used between lid and cladding, then the structure is simple, but adhesion is insufficient under thermal stress
Solution Approach 1:
The invention replaces the flat bonding surface with protrusions that have curved surfaces. These curved surfaces increase the actual bonding area compared to a flat surface of the same footprint, and the curvature allows for better stress distribution and deformation accommodation under thermal loading, thereby improving adhesion without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the bonding strength and reduces deterioration in airtightness by allowing the bond to deform along the protrusions, mitigating the effects of thermal expansion and maintaining a reliable seal.
Implementation Method 1
thermal expansion differences between the cladding, lid, and bond
Implementation Method 2
increasing the bonding area between the lid and cladding, thereby enhancing adhesion
Data Source
AI summary
A light-emitting device includes an optical waveguide package, a light-emitting element in an element mount, and a lid covering the element mount. The optical waveguide package includes a substrate including a first surface, a cladding on the first surface and including a second surface facing the first surface, a third surface opposite to the second surface, and the element mount with an opening in the third surface, and a core in the cladding. The cladding includes a first portion having the core inside, and a second portion facing the first portion across the element mount. The first portion includes a plurality of first protrusions in an area of the third surface corresponding to the first portion. The second portion includes a plurality of second protrusions in an area of the third surface corresponding to the second portion.