Impedance-Matched Waveguide Package for High-Frequency Signal Integrity
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Solution Overview
Problem
Conventional high-frequency device packages are costly and suffer from performance degradation due to signal mismatch and frequency range limitations, as they lack impedance-matched waveguide structures from the device to the PCB, and require exotic attachment methods, making them unsuitable for low-cost, high-speed applications.
Innovation Solution
A high-frequency device package with impedance-matched waveguide structures from the circuit device to the PCB, utilizing a low-cost industry-standard packaging approach, incorporating optimized leadframe and dielectric materials to achieve controlled impedance and minimize signal loss, and conforming to industry standards for standard pick-and-place and solder attach, thereby enabling efficient signal transmission up to over 70 GHz with minimal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional high-frequency packages use metal and ceramic laminates with controlled-impedance planar waveguide structures, then signal transmission quality is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent changes the material parameters and structural configuration of the package substrate, using a combination of plastic and metal layers with specific impedance-controlled trace geometries to achieve high-frequency signal transmission without requiring expensive ceramic laminates
Solution Approach 2:
The patent replaces expensive metal and ceramic laminate materials with a cost-effective plastic-based substrate structure that can achieve similar electrical performance, significantly reducing manufacturing cost while maintaining signal integrity
2Ease of manufacture
If conventional packages use wire bonds or ribbon bonds to connect device to waveguide, then connection is achieved, but signal mismatch and inductance effects occur at high frequencies
Solution Approach 1:
The patent extracts and eliminates the wire bond or ribbon bond connection method from the signal path, directly connecting the device to the controlled-impedance trace on the package substrate, thereby removing the inductance and signal mismatch problems associated with traditional bonding methods
Solution Approach 2:
The patent merges the device connection directly with the controlled-impedance trace structure, eliminating the intermediate bonding layer and creating a continuous impedance-matched signal path from the device through the package to the PCB
3Speed
If frequency range is extended beyond what matching networks can handle, then bandwidth is improved, but inductance effects from bonds and bumps cannot be cancelled
Solution Approach 1:
The patent performs preliminary impedance matching by designing the package substrate traces with controlled impedance from the outset, rather than attempting to cancel inductance effects through matching networks after the fact, enabling extended frequency range without inductance cancellation issues
4Reliability
If exotic lead attachment methods are used to achieve controlled impedance, then signal integrity is improved, but cost and complexity increase
Solution Approach 1:
The patent designs the package substrate with controlled-impedance traces that can accommodate standard lead attachment methods while maintaining signal integrity, making the solution universally applicable to conventional manufacturing processes without requiring exotic attachment techniques
Data Source
AI summary
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.