Waveguide-to-PCB Differential Transition Without Vias
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Solution Overview
Problem
Existing transitions from hollow radio frequency waveguides to planar differential pair transmission lines suffer from bandwidth limitations, require costly and bulky vias, and are limited to edge or corner placements, making them inefficient and difficult to manufacture.
Innovation Solution
A transition unit is designed with an end section of the differential pair transmission line configured as a radio frequency signal emission pattern, and an end section of the waveguide attached to the substrate layer arrangement, superposing the emission pattern. A back cavity is used to prevent signal leakage, allowing the transition unit to be placed arbitrarily on the substrate without the need for vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional transition methods are used from hollow waveguide to planar differential pair transmission line, then the transition can be achieved, but bandwidth limitations occur and the structure becomes bulky requiring vias
Solution Approach 1:
The invention extracts and eliminates the via structure from the transition design. By using a planar printed circuit board with a discontinuous ground plane pattern instead of vias, the transition achieves broadband performance without the structural complexity and bandwidth limitations imposed by conventional via-based transitions.
Solution Approach 2:
The invention transitions from a three-dimensional via-based structure to a two-dimensional planar structure. The discontinuous ground plane pattern on the PCB surface provides the necessary electromagnetic field control without requiring vertical via holes, thereby simplifying the structure and expanding bandwidth.
2Ease of manufacture
If vias are used in the substrate layer arrangement for transition, then the transition can be implemented, but manufacturing cost increases and applicability to all substrate technologies is limited
Solution Approach 1:
The invention removes the via component entirely from the transition structure. The discontinuous ground plane pattern on the PCB provides the necessary electromagnetic coupling and field control that would otherwise require vias, thereby simplifying manufacturing and enabling compatibility with all substrate technologies including multilayer glass.
Solution Approach 2:
The invention replaces the mechanical via structure (physical holes through substrates) with an electromagnetic field-based solution using discontinuous ground plane patterns. This substitution eliminates the need for mechanical drilling and plating processes, reducing manufacturing complexity and cost.
3Productivity
If conventional transition structures are used, then the transition is achieved, but the transition units must be geometrically well separated due to bulkiness
Solution Approach 1:
The invention compresses the transition structure from a bulky three-dimensional form to a compact two-dimensional planar pattern. The discontinuous ground plane design achieves the necessary electromagnetic field control within the PCB surface area, allowing transition units to be placed much closer together without interference.
Solution Approach 2:
The invention segments the ground plane into discontinuous patterns rather than using a continuous ground structure. This segmentation allows multiple transition units to operate in close proximity by isolating their electromagnetic fields, thereby increasing transition density while maintaining performance.
4Adaptability or versatility
If insertion of substrate layer into waveguide is required, then transition is achieved, but placement is limited to edge or corner points of substrate
Solution Approach 1:
The invention extracts the substrate insertion requirement from the transition design. By using a discontinuous ground plane pattern on the PCB surface, the transition can be implemented without inserting the substrate into the waveguide, thereby enabling placement anywhere on the substrate surface including central regions.
Solution Approach 2:
The invention moves the transition implementation from a three-dimensional substrate insertion approach to a two-dimensional surface-mounted discontinuous ground plane pattern. This dimensional change provides placement flexibility across the entire substrate surface rather than being constrained to edges or corners.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transition unit enables efficient radio frequency signal transition with reduced leakage, allowing for more flexible and compact design of radio frequency devices without the constraints of prior art.
Implementation Method 1
an end section of the differential pair transmission line that is configured as a radio frequency signal emission pattern
Implementation Method 2
the back cavity prevents a part of the radio frequency signal emission that is emitted from the emission pattern from leaking outside of the end section of the waveguide
Data Source
AI summary
A transition unit of a radio frequency device provides a transition between a planar differential pair transmission line and a hollow radio frequency waveguide. A substrate layer arrangement with a planar differential pair transmission line is arranged on one or more surfaces of at least one substrate layer. An end section of the transmission line is configured as a radio frequency signal emission pattern. The transition unit has an end section of a waveguide for electromagnetic waves that is attached to the substrate layer arrangement and superposes the radio frequency signal emission pattern. The waveguide is directed perpendicular to the substrate layer arrangement. An open end of the end section of the wave-guide is attached to a first outer surface or a second outer surface of the substrate layer arrangement. Opposite to the end section a back cavity is attached with an open end towards the substrate layer arrangement.