Waveguide Photodiode Layout With Offset Contacts for High Responsivity

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Solution Overview

Problem

Photodiodes face challenges in achieving high responsivity and bandwidth due to competition between semiconductor material absorption and metal electrode absorption, leading to degraded quantum efficiency, especially in high bandwidth applications where metal electrodes are close to the optical signal.

Innovation Solution

The introduction of an elongate doped semiconductor structure that extends beyond the semiconductor material's sides, allowing metal contacts to be offset and reducing absorption competition, thereby maintaining high responsivity with thinner semiconductor regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If metal electrodes are placed close to the optical signal to achieve high bandwidth, then carrier transit speed is improved, but quantum efficiency and responsivity are degraded due to absorption competition

Engineering Contradiction:
Improvecarrier transit speedVSAvoidquantum efficiency
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent introduces an elongate semiconductor structure that extends in a lateral dimension beyond the semiconductor material's sides, creating a three-dimensional configuration. This allows metal contacts to be offset laterally while maintaining electrical connection, thereby separating the metal electrodes from the optical signal path in the lateral dimension while preserving vertical carrier transit efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The elongate doped semiconductor structure serves as an intermediary between the metal contacts and the intrinsic semiconductor material. It provides electrical connection to the metal electrodes while physically separating them from the optical signal region, thus mediating the conflict between electrical connection requirements and optical absorption efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Speed

If semiconductor layer thickness is reduced to improve bandwidth, then carrier transit time is decreased, but optical absorption and responsivity are reduced

Engineering Contradiction:
Improvecarrier transit timeVSAvoidresponsivity
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent compensates for reduced vertical absorption in thinner semiconductor layers by introducing lateral extension through elongate structures. This dimensional transition allows the photodiode to maintain effective absorption volume while reducing vertical thickness for faster carrier transit.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a composite structure combining intrinsic semiconductor material for optical absorption with doped semiconductor regions for electrical conduction and structural support. This composite approach allows optimization of each region's thickness independently - thin intrinsic region for fast transit, thicker doped regions for electrical functionality.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances carrier transit without sacrificing responsivity, improving photodiode performance by reducing parasitic resistance and capacitance while maintaining high bandwidth.

Implementation Method 1

a portion of the semiconductor material is in optical communication with a region of the optical waveguide

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

the at least one elongate portion is doped with N+ dopants

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20240361523A1Waveguide integrated photodiode
Publication Date: 2024.10.31 CISCO TECHNOLOGY INC
  • US20240361523A1 patent drawing
  • US20240361523A1 patent drawing
  • US20240361523A1 patent drawing

AI summary

In part, in one aspect, the disclosure relates to a photodiode. The photodiode may include a substrate; a semiconductor layer comprising an semiconductor material, the semiconductor layer disposed on the substrate and in communication with at least a region of the substrate, the semiconductor layer having a first side, a second side, and an upper surface, the semiconductor layer having a height; a semiconductor structure partially disposed on the upper surface, the semiconductor structure comprising at least one elongate portion that extends beyond the first side and along a portion of the upper surface of the semiconductor layer; and a metal contact that is in electrical connection with the elongate portion of the semiconductor structure.