Metallic Waveguide Plate Heat Dissipation in Phased Array Antennas
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Solution Overview
Problem
Existing phased array antenna systems with antenna-integrated printed wiring boards face issues with heat dissipation, leading to reduced Effective Isotropic Radiated Power (EIRP), increased noise, and limited upper frequency operation due to the use of dielectric materials in waveguide portions.
Innovation Solution
A phased array antenna system is constructed using a metallic waveguide plate and multi-layer printed wiring board assembly, where the metallic waveguide plate is positioned adjacent to the printed wiring board to dissipate heat generated by electronic devices, with cylindrical waveguides and integrated metallic pedestals enhancing heat dissipation and frequency operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material is used in the waveguide portion of printed wiring boards, then insulation is provided, but heat dissipation is poor leading to degraded system performance
Solution Approach 1:
The patent employs a multi-layer construction combining dielectric material layers with metallic waveguide plates. The dielectric layers provide insulation for circuit traces while the metallic waveguide plates serve as heat dissipation pathways. This composite structure allows simultaneous achievement of electrical insulation and thermal management, resolving the contradiction between insulation requirements and heat dissipation needs.
2Adaptability or versatility
If a cage-like conductive structure is used for the antenna element, then the antenna can be constructed, but the upper frequency of operation is limited
Solution Approach 1:
The patent inverts the traditional cage-like conductive structure by using a solid metallic waveguide plate with precisely positioned waveguide openings. This inversion maintains the necessary conductive pathways for lower frequency operation while the solid plate structure supports higher frequency operation, thereby expanding the operating frequency range without significantly increasing structural complexity.
3Power
If excess heat is generated by electronics in the printed wiring board, then power processing capability increases, but EIRP decreases and noise increases
Solution Approach 1:
The metallic waveguide plate acts as an intermediary thermal management component between the electronic devices generating heat and the surrounding environment. It provides a dedicated thermal pathway that conducts heat away from the electronics, allowing high power operation without the penalty of degraded EIRP or increased noise, thus resolving the contradiction between power capability and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in higher EIRP, lower noise, increased power level per unit cell, and a larger operating frequency range, improving the overall performance of the phased array antenna system.
Implementation Method 1
heat generated by the at least one electronic device dissipates to the metallic waveguide plate
Data Source
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AI summary
A system and method of constructing a phased array antenna (10) system that incorporates a printed wiring board assembly (12) with a metallic waveguide plate (14) is provided. The system uses a metallic waveguide plate to dissipate heat toward and through the waveguide portion of the system.