Waveguide Propagation Apparatus Hermetic Packaging

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Solution Overview

Problem

Existing waveguide propagation systems face challenges in achieving hermeticity without increasing complexity and cost, and suffer from performance degradation due to cabling components used in transitions between microstrip and waveguide propagations.

Innovation Solution

A waveguide propagation apparatus that eliminates the need for cabling by using a conductive pin linked to a microstrip line, mounted with a solder ring for hermeticity, and includes a coaxial connector for direct signal transfer, minimizing noise and power loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a hermetic window is used at the waveguide opening to achieve hermeticity, then hermeticity is improved, but device complexity and cost increase

Engineering Contradiction:
ImprovehermeticityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the hermetic window component entirely by extracting the hermetic sealing function from the waveguide opening and relocating it to the coaxial connector interface. The coaxial connector itself serves as the hermetic barrier, eliminating the need for additional hermetic windows and reducing structural complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The coaxial connector is designed to serve multiple functions simultaneously: it provides the transition between microstrip and waveguide propagations, ensures hermetic sealing, and enables direct signal transfer. This multi-functionality eliminates the need for separate hermetic window components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a cabling component is used to link the coaxial connector and microwave module, then hermeticity is improved, but performance degrades due to noise and power loss

Engineering Contradiction:
ImprovehermeticityVSAvoidpower loss and noise
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent merges the coaxial connector and microwave module into a single integrated structure where the conductive pin directly connects the microstrip line to the waveguide. This eliminates the cabling component and reduces signal path length, minimizing noise and power loss while maintaining hermeticity through the integrated design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive pin serves as an intermediary element that directly transfers signals from the microstrip line to the waveguide without requiring external cabling. This internal conductive connection eliminates the performance-degrading cabling component while maintaining hermetic sealing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures hermetic packaging while maintaining high performance by eliminating cabling-induced noise and power loss, achieving efficient electromagnetic signal transfer between microstrip and waveguide propagations.

Implementation Method 1

The conductive pin (2.1) is mounted to the microwave module (2) by the solder ring (2.2) which surrounds the conductive pin (2.1) when it is melted, and ensuring hermeticity with the microwave module (2) on the mounting area

Methodology Applied
Scientific EffectHermetic sealing:

Implementation Method 2

The conductive pin (2.1) installed in the microwave module (2), linked to a microstrip line enabling electromagnetic propagation

Methodology Applied
Scientific EffectElectromagnetic propagation:

Data Source

PatentUS9362607B2Waveguide propagation apparatus compatible with hermetic packaging
Publication Date: 2016.06.07 ASELSAN ELEKTRONIK SANAYI & TICARET ANONIM SIRKETI
  • US9362607B2 patent drawing
  • US9362607B2 patent drawing
  • US9362607B2 patent drawing

AI summary

This topic is related to a waveguide propagation apparatus, converting microstrip propagation to waveguide propagation, providing hermeticity on the mounting area, eliminating the cabling component causing degradation on the overall performance, involving at least a microwave module (2), and comprising a combination of a base part (3) and a cover part (4).