Waveguide Assembly Reinforcement for Flexural Load Management

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Solution Overview

Problem

Optical waveguide assemblies face delamination and de-bonding issues due to limited adhesive areas and flexural loads, which compromise their mechanical integrity and optical performance.

Innovation Solution

Incorporating reinforcement members, such as frames or bars, coupled to the waveguide assembly at strategic locations to reduce deflection under flexural loads without interfering with the optical functionality, and using adhesive reinforcement to enhance bonding between extractor plates and the waveguide body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive is used to bond extraction elements to the waveguide body, then optical performance is maintained, but bond integrity deteriorates under flexural loads due to limited bonded area

Engineering Contradiction:
Improvebond integrityVSAvoidbonded surface area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The reinforcement structure divides the bonding system into multiple load-bearing paths: the adhesive layer handles optical region bonding while the reinforcement structure (border, frame, or pattern) handles mechanical load distribution, segmenting the functional requirements between different structural elements

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution combines the adhesive material (optimized for optical performance) with a reinforcement material (optimized for mechanical strength) to create a composite bonding system where each material performs its specialized function without compromising the other

Inventive Principle:
Principle #40Composite materials

2Illumination intensity

If extraction elements are bonded with limited adhesive to maintain optical performance, then optical functionality is preserved, but mechanical strength deteriorates under flexural loads

Engineering Contradiction:
Improveoptical performanceVSAvoidmechanical strength
Core Design Contradiction:
Illumination intensityVSStrength

Solution Approach 1:

The bonding system is segmented into optical function zones (adhesive regions) and mechanical function zones (reinforcement regions), allowing the adhesive to be optimized for optical clarity and light transmission while the reinforcement structure is optimized for mechanical load-bearing capacity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The reinforcement structure acts as an intermediary element between the extraction elements and the waveguide body, mediating the mechanical loads and preventing stress transmission to the adhesive-bonded optical regions, thereby protecting the optical bonding from mechanical degradation

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If reinforcement members are added to the waveguide assembly, then deflection under flexural loads is reduced, but device complexity increases

Engineering Contradiction:
Improveresistance to deflectionVSAvoidassembly complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The reinforcement structure is merged with the extraction element assembly itself, where the reinforcement border or frame becomes an integrated part of the extractor plate or mounting structure, eliminating the need for separate reinforcement components and simplifying the overall assembly process

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The reinforcement structure serves multiple functions simultaneously: it provides mechanical strength to resist deflection, distributes adhesive loads across the assembly, maintains alignment between components, and can even serve as a mounting feature for the extraction elements, thereby reducing the need for additional specialized components

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11156764B2Bonded optical systems and applications thereof
Publication Date: 2021.10.26 LED-IP MANAGEMENT LLC
  • US11156764B2 patent drawing
  • US11156764B2 patent drawing
  • US11156764B2 patent drawing

AI summary

In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.