Waveguide RF Chip Assembly With Elastic Connections for Thermal Stress
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Solution Overview
Problem
RF devices face challenges in signal routing and redistribution between the chip and antenna, particularly in radar applications, where mechanical and electrical connections affect electromagnetic performance and cost-effectiveness, and existing solutions do not adequately address mechanical stresses during manufacturing and operation.
Innovation Solution
The RF device incorporates a semiconductor device with a radio-frequency chip and a waveguide component, featuring elastic connection elements to reduce mechanical stresses and a spacer with a higher melting point to maintain a constant distance between the semiconductor device and the circuit board, ensuring precise alignment and reduced crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid connection elements are used to mechanically connect the semiconductor device to the circuit board, then mechanical strength and electrical connection are improved, but mechanical stresses during thermal expansion and contraction worsen connection reliability
Solution Approach 1:
The connection elements are designed with elastic properties that allow them to deform under thermal stress, changing their mechanical parameters dynamically. This elasticity enables the connection elements to accommodate thermal expansion and contraction without failing, resolving the contradiction between maintaining strong mechanical connections and reliability under thermal stress.
Solution Approach 2:
The elastic connection elements are designed in advance to absorb and cushion mechanical stresses that will occur during thermal cycling. By incorporating this cushioning capability from the design stage, the connection elements can withstand repeated thermal expansion and contraction without damage, improving reliability while maintaining connection strength.
2Device complexity
If the waveguide component is directly connected to the circuit board, then device complexity is reduced, but mechanical stresses from thermal expansion affect the semiconductor device
Solution Approach 1:
The semiconductor device serves as an intermediary component between the waveguide component and the circuit board. This intermediate position allows the semiconductor device to buffer and isolate mechanical stresses from reaching the waveguide component, reducing stress transmission while maintaining a relatively simple overall structure.
Solution Approach 2:
The connection structure is segmented into distinct functional zones: the waveguide component connection area, the semiconductor device mounting area, and the circuit board connection area. This segmentation allows each component to handle stresses independently, with the semiconductor device acting as a stress isolation zone, thereby reducing overall mechanical stress while maintaining structural simplicity.
3Ease of manufacture
If conventional manufacturing processes are used without spacers, then manufacturing precision is sufficient for basic connections, but alignment precision between semiconductor device and circuit board deteriorates under thermal stress
Solution Approach 1:
Alignment marks are pre-defined on the circuit board before the semiconductor device is mounted. These preliminary markings guide the precise positioning of the semiconductor device during assembly, ensuring correct alignment is established before thermal stress occurs. This preliminary alignment action maintains precision even when thermal expansion and contraction occur during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the electromagnetic performance and cost-effectiveness of RF devices by minimizing mechanical stresses and maintaining precise alignment, thereby improving signal transmission efficiency and reducing the risk of connection failures.
Implementation Method 1
At least one from the first connection element or the second connection element is embodied in an elastic fashion
Implementation Method 2
The spacer has a higher melting point than the first connection element. The spacer is configured to provide a constant distance between the semiconductor device and a circuit board upon the semiconductor device being mechanically connected to the circuit board
Data Source
AI summary
A radio-frequency device comprises a semiconductor device, comprising a radio-frequency chip, and a first connection element, which is configured to mechanically and electrically connect the semiconductor device to a circuit board. The radio-frequency device furthermore comprises a waveguide component arranged over the semiconductor device, comprising a waveguide embodied in the waveguide component, and a second connection element, which mechanically connects the waveguide component to the semiconductor device. At least one from the first connection element or the second connection element is embodied in an elastic fashion.