Waveguide RF Module for LO Distribution in mm-Wave MIMO
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Solution Overview
Problem
Existing RF modules for mm-wave applications face increased manufacturing costs and space limitations when trying to implement multiple antennas for MIMO operations, as they require specific layers on printed circuit boards to reduce RF loss and often need additional components for local oscillator signal distribution, which can involve down-conversion and up-conversion.
Innovation Solution
The proposed RF module uses a waveguide antenna with hollow waveguides to transfer RF signals and local oscillator signals between semiconductor circuit devices, eliminating the need for specific layers on the printed circuit board and allowing synchronization without down-converting the local oscillator signal, thus reducing costs and enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antennas are arranged on the printed circuit board to achieve MIMO operations, then the number of transmit and receive channels is increased, but manufacturing costs are increased due to requiring specific layers to reduce RF loss above 20 GHz
Solution Approach 1:
The patent transitions from planar PCB trace transmission to three-dimensional waveguide transmission through vertical openings in the PCB. This dimensional change allows RF signals to be transmitted through the PCB thickness rather than along its surface, eliminating the need for expensive specific PCB layers while maintaining signal integrity at mm-wave frequencies
Solution Approach 2:
The patent extracts the RF signal transmission function from the PCB trace system and relocates it to dedicated waveguide structures. By separating the transmission path from the signal processing plane, the system eliminates the need for costly RF-optimized PCB layers while preserving multi-channel capability
2Device complexity
If antennas are provided within each package of semiconductor circuit devices, then integration is improved, but specific packages are required increasing costs and space limitations may limit the number of antennas increasing the number of MMICs required
Solution Approach 1:
The patent creates a universal antenna structure that can serve multiple MMIC devices simultaneously. The waveguide antenna system with multiple openings can distribute LO signals to multiple semiconductor circuit devices through a single shared infrastructure, eliminating the need for device-specific packages and reducing overall system cost
3Ease of operation
If local oscillator signal is distributed through additional components involving down-conversion and up-conversion, then signal distribution is achieved, but device complexity and manufacturing costs are increased
Solution Approach 1:
The patent extracts the LO signal distribution function from the conventional component-based approach and implements it through integrated waveguide structures. By removing the need for down-conversion and up-conversion components, the system simplifies the signal path while maintaining distribution capability across multiple devices
Solution Approach 2:
The waveguide openings in the PCB serve as an intermediary structure that directly couples the LO signal from one MMIC to another without requiring intermediate conversion components. This mediator approach enables direct high-frequency signal transfer through the PCB substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a compact, cost-effective, and high-performance RF module capable of operating in high-frequency microwave regions above 60 GHz without additional components, enabling efficient synchronization and signal processing across multiple antennas.
Implementation Method 1
a first hollow waveguide formed in the body, and a second hollow waveguide formed in the body, wherein the second hollow waveguide is coupled to the antenna element
Data Source
AI summary
An RF module comprises a circuit board, a waveguide antenna, first and second semiconductor circuit devices, and first, second, and third RF ports. The first semiconductor circuit device including a local oscillator to generate a local oscillator signal. The circuit board includes a first opening between the first RF port and a first waveguide port for transferring the local oscillator signal from the first RF port into the first hollow waveguide. The circuit board includes a second opening between the second RF port and a second waveguide port to receive the local oscillator signal from the first hollow waveguide. The second semiconductor circuit device is configured to process a first RF signal based on the received local oscillator signal. The circuit board includes a third opening for transferring the first RF signal between the third RF port and a third waveguide port.