Waveguide to SIW Transit Structure Using Non-Resonating Slot

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Solution Overview

Problem

Current transit structures for waveguides and Substrate Integrated Waveguides (SIWs) in automotive radar systems require additional substrates and complex processes, increasing cost and reducing efficiency due to non-uniform signal transmission characteristics across a broad frequency band.

Innovation Solution

A transit structure that directly couples a metallic waveguide to a SIW using a dielectric substrate with a non-resonating slot and impedance matching via vias, eliminating the need for additional substrates and allowing for uniform signal transmission across a broad frequency band.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional transit structure with additional substrate is used to connect waveguide and SIW, then the connection between waveguide and SIW is achieved, but the device size, weight, and manufacturing complexity increase

Engineering Contradiction:
Improveconnection between waveguide and SIWVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the transit structure directly into the existing SIW substrate by etching a non-resonating slot, eliminating the need for a separate additional substrate. This integration reduces the number of components and simplifies the overall device structure while maintaining the waveguide-SIW connection functionality

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The SIW substrate serves multiple functions: it acts as both the transmission line substrate and the mounting platform for the waveguide. The non-resonating slot in the ground plane provides both mechanical support and electromagnetic coupling, making the structure multi-functional and reducing overall complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a conventional transit structure with additional substrate is used, then waveguide-SIW connection is established, but manufacturing cost and process complexity increase

Engineering Contradiction:
Improvewaveguide-SIW connectionVSAvoidmanufacturing process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The transit structure is combined with the SIW substrate fabrication process, allowing both to be manufactured in the same production line using standard PCB techniques. This eliminates the need for separate substrate assembly and reduces manufacturing steps

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The non-resonating slot structure provides self-aligning and self-supporting characteristics that facilitate automated assembly. The slot geometry naturally guides the waveguide positioning, reducing the need for complex alignment procedures and specialized manufacturing processes

Inventive Principle:
Principle #25Self-service

3Reliability

If conventional transit structure is used, then connection is achieved, but signal transmission uniformity across broad frequency band deteriorates

Engineering Contradiction:
Improveconnection establishmentVSAvoidsignal transmission uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The non-resonating slot is strategically positioned and dimensioned to create localized electromagnetic field distribution that ensures uniform signal transmission across the broad frequency band. The slot's specific geometry (width, length, and position relative to the waveguide aperture) is optimized to maintain consistent impedance matching throughout the operating bandwidth

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent optimizes specific parameters of the non-resonating slot (width w, length l, position) to achieve broadband impedance matching. By carefully controlling these dimensional parameters, the structure maintains uniform signal transmission characteristics across the entire frequency band from 73 GHz to 80 GHz

Inventive Principle:
Principle #35Parameter changes

4Reliability

If additional substrate is used for transit structure, then waveguide-SIW transition is enabled, but size and weight of the system increase

Engineering Contradiction:
Improvewaveguide-SIW transitionVSAvoidtransit structure volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The transit structure is merged with the SIW substrate, eliminating the need for a separate additional substrate. This integration significantly reduces the overall volume and weight of the transit structure while maintaining the waveguide-SIW transition functionality

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the transit structure from being a separate component and integrates it directly into the SIW substrate. By removing the additional substrate requirement and incorporating the transition structure within the existing substrate, the overall system volume and weight are reduced

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces size, weight, and cost while maintaining efficient signal transmission with minimal loss across the required frequency band, achieving a relative bandwidth of approximately 5.4% with low signal distortion.

Implementation Method 1

A region of the second conductor corresponding to an aperture of the waveguide is etched to form a non-resonating slot

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 2

a stub which is formed in a region where the non-resonating slot is formed in order to perform impedance matching between the SIW and the waveguide

Methodology Applied
Scientific EffectImpedance matching: Electrical Impedance Tomography

Implementation Method 3

a plurality of vias which is disposed in the dielectric substrate in accordance with a predetermined pattern to form a transmission path through which the signal is transmitted in the SIW

Methodology Applied
Scientific EffectElectromagnetic wave transmission: Waveguide

Data Source

PatentUS9450281B2Transit structure of waveguide and SIW
Publication Date: 2016.09.20 HYUNDAI MOBIS CO LTD
  • US9450281B2 patent drawing
  • US9450281B2 patent drawing
  • US9450281B2 patent drawing

AI summary

A transit structure of a waveguide and a SIW is provided. According to the present invention, a SIW and a waveguide are directly connected so that when a signal is transited with a reduced loss and a signal is transmitted while satisfying a frequency band width required for an automotive radar. Further, signal transmission characteristic at every frequency in a bandwidth may be uniformly maintained. Further, an additional dielectric substrate is not required so that a reduced size, a reduced weight, and a reduced cost may be achieved and a process of bonding different substrates is not required.