Integrated Waveguide With Slotted Feed Transition for High-Speed IC Communication
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Solution Overview
Problem
Conventional planar transmission lines in multi-chip package structures experience signal attenuation and frequency dispersion when transmitting high-frequency signals, making it difficult to achieve high-speed communication links required for millimeter-wave to Terahertz frequencies applications.
Innovation Solution
The integration of waveguides within package structures, coupled with transmission line to waveguide transitions, enables high-speed data communication between IC chips by using a substrate with metallic plates and sidewalls, and slotted feed to waveguide transitions, allowing for efficient signal transmission at Gbps to hundreds of Gbps data rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional planar transmission lines are used for signal transmission, then the structure is simple and easy to manufacture, but signal attenuation and frequency dispersion occur at high frequencies
Solution Approach 1:
The patent transitions from planar transmission line geometry to a three-dimensional waveguide structure, fundamentally changing the transmission parameter space. This structural parameter change enables high-frequency signal transmission by confining electromagnetic fields within metallic walls, reducing attenuation and dispersion while maintaining manufacturability through standard semiconductor fabrication processes
Solution Approach 2:
The invention moves from two-dimensional planar transmission lines to three-dimensional waveguide structures with vertical metallic plates and sidewalls. This dimensional transition creates enclosed transmission paths that reduce signal loss and improve transmission quality at high frequencies, while the waveguide can be integrated into existing package substrates
2Reliability
If waveguides are integrated into package structures to reduce signal attenuation, then signal transmission quality improves, but device complexity increases
Solution Approach 1:
The patent combines the waveguide transmission path with the package substrate structure itself, integrating metallic plates and sidewalls directly into the packaging architecture. This merging eliminates the need for separate waveguide components, reducing overall device complexity while maintaining the low-loss transmission benefits of waveguide structures
Solution Approach 2:
The waveguide structure serves multiple functions: it provides low-loss signal transmission, acts as a structural support element within the package, and can be configured to support multiple transmission lines for differential signaling. This multi-functionality reduces the need for additional components, offsetting the increased structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides low-loss, high-speed data communication channels between IC chips, effectively addressing the limitations of conventional transmission lines by reducing signal attenuation and enabling efficient operation at high frequencies.
Implementation Method 1
a waveguide having a first metallic plate, a second metallic plate, metallic sidewalls connecting the first and second metallic plates
Data Source
AI summary
Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.