Optical Waveguide Wiring Substrate for Direct Component Coupling
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Solution Overview
Problem
Existing optical component mounting substrates require complex structures with reflectors and cladding layers to achieve efficient optical coupling, leading to increased complexity and reduced coupling efficiency due to the need for light path conversion and large distances between optical components.
Innovation Solution
A wiring substrate design featuring an insulating layer with a conductor pad and an optical waveguide having a core part that is positioned adjacent to a component region, allowing direct optical coupling without the need for reflectors or cladding layers, with the optical waveguide's end surface facing the component region for efficient light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflectors and cladding layers are added to achieve efficient optical coupling, then optical coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent extracts and removes the reflector and cladding layer components from the optical coupling structure. By positioning the optical waveguide's core part end surface directly adjacent to the component region, the design eliminates the need for these additional optical elements, thereby reducing structural complexity while maintaining optical coupling functionality.
Solution Approach 2:
The patent introduces an insulating layer as an intermediary medium between the optical waveguide core part and the component region. This insulating layer enables direct optical coupling without requiring reflectors or cladding layers, simplifying the overall structure while ensuring proper optical transmission and electrical isolation.
2Reliability
If light path conversion is implemented, then optical coupling is achieved, but the distance between optical components increases
Solution Approach 1:
The patent removes the light path conversion mechanism from the optical coupling design. By enabling direct optical coupling through the insulating layer, the design eliminates the need for additional optical path conversion elements, thereby minimizing the distance between the optical waveguide and the component region.
3Reliability
If complex optical structures are used, then optical coupling efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent extracts complex optical structures such as reflectors and cladding layers from the design. This simplification reduces the number of precise alignment requirements during manufacturing, as the direct optical coupling through the insulating layer requires fewer critical positioning tolerances compared to multi-element optical structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the structure and enhances optical coupling efficiency between the optical waveguide and components, enabling high-frequency transmission and denser component mounting with improved coupling efficiency.
Implementation Method 1
an optical waveguide that includes a core part for transmitting light
Data Source
AI summary
A wiring substrate includes an insulating layer, a conductor pad that is formed on a surface of the insulating layer and is connected to a component such that the insulating layer has a component region that is covered by the component connected to the conductor pad, and an optical waveguide including a core part that transmits light and is positioned on an outer side of the component region of the insulating layer such that the core part has an end surface exposed and facing a component region side. The optical waveguide is positioned such that the end surface of the core part is adjacent to the component region.