Waveguide Substrate Structure for Dense Through-Hole Strength
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Solution Overview
Problem
Waveguide substrates with densely arrayed through holes face significant strength reduction during manufacturing, making subsequent processing of conductive layers challenging.
Innovation Solution
A waveguide substrate design that includes first and second through holes with conductive layers and filler materials, and third conductive layers overlapping these holes, maintaining substrate strength by stabilizing conductive layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If through holes are densely arrayed in the substrate to create waveguide structure, then the waveguide functionality is achieved, but the strength of the substrate is significantly reduced
Solution Approach 1:
The patent applies preliminary action by forming conductive layers on the inner walls of through holes and filling them with filler material before completing the substrate structure. This sequence ensures that the conductive pathways are established while the substrate still has sufficient structural integrity, preventing strength degradation that would occur if holes were formed and left empty.
Solution Approach 2:
The patent uses composite materials by combining the substrate material with conductive layers and filler materials within the through holes. This creates a hybrid structure where the filler material reinforces the substrate around the through holes, maintaining overall strength while enabling the waveguide functionality through the conductive pathways.
2Ease of manufacture
If through holes are formed through the substrate, then conductive pathways are created, but subsequent processing such as plating becomes difficult
Solution Approach 1:
The patent performs preliminary action by forming the conductive layers on the inner walls of through holes and filling them with appropriate materials before completing the substrate assembly. This preliminary conductive layer formation simplifies subsequent processing steps, as the conductive pathways are already in place and do not require complex plating operations on pre-formed holes.
Data Source
AI summary
A waveguide substrate includes a core substrate through which first through holes and second through holes are formed, a first conductive layer covering an inner wall of the first through holes and both sides of the core substrate, a second conductive layer covering an inner wall of the second through holes and both sides of the core substrate, a first filler material filling a space surrounded by the first conductive layer inside the first through holes, a second filler material filling a space surrounded by the second conductive layer inside the second through holes, and third conductive layers disposed on respective sides of the core substrate, the third conductive layers overlapping the first and second through holes in a plan view, and the third conductive layers being electrically connected to the first and second conductive layers, wherein the second conductive layer overlaps the first through holes in the plan view.