Waveguide Substrate Joining for Lower Thermal Resistance
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Solution Overview
Problem
The existing waveguide devices face challenges in reducing thermal resistance, particularly at the adhered portions, which can lead to heat dissipation issues and degradation of connected active devices.
Innovation Solution
A waveguide device configuration that includes a resin material substrate supported by a support substrate, with direct joining between the two substrates, and optionally utilizing a first ground electrode and a joining portion to enhance thermal dissipation and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If organic adhesive is used to bond the upper substrate and the substrate, then the bonding strength is sufficient, but the thermal resistance of the adhered portion increases
Solution Approach 1:
A ground electrode layer is introduced as an intermediary between the upper substrate and the substrate. This ground electrode layer serves dual functions: it provides electrical grounding and acts as a thermal conduction path to reduce thermal resistance at the bonding interface, while the organic adhesive maintains bonding strength.
Solution Approach 2:
The bonding structure uses a composite approach combining organic adhesive for mechanical bonding with a metal ground electrode layer for thermal conduction. This composite structure leverages the strengths of different materials: the adhesive provides bonding strength while the metal layer provides low thermal resistance.
2Ease of manufacture
If organic adhesive is used to bond the substrates, then the manufacturing process is simple, but heat dissipation from active devices is impaired
Solution Approach 1:
The ground electrode layer acts as a thermal intermediary that conducts heat away from active devices mounted on the upper substrate. It provides a low-resistance thermal path through the bonding interface to the substrate, improving heat dissipation while maintaining the simplicity of the bonding process.
Solution Approach 2:
The ground electrode layer serves multiple functions simultaneously: electrical grounding, thermal conduction for heat dissipation, and structural support. This multi-functionality improves heat dissipation efficiency without complicating the manufacturing process.
3Stability of the object's composition
If the upper substrate is heated due to poor thermal conduction, then the bonding structure remains intact, but the characteristics of connected active devices degrade
Solution Approach 1:
The ground electrode layer serves as a thermal intermediary that conducts heat away from active devices before it can cause temperature rise and performance degradation. It maintains bonding structure stability while protecting active devices from thermal effects.
Solution Approach 2:
The ground electrode layer provides beforehand thermal cushioning by creating a low-resistance thermal path that prevents heat accumulation. This proactive thermal management protects active devices from temperature-induced performance degradation before it occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration effectively reduces thermal resistance, improves heat dissipation, and enhances the mechanical strength of the waveguide device, thereby preventing degradation of connected active devices.
Implementation Method 1
the first ground electrode may be in direct contact with the resin material substrate and the support substrate to function as a joining portion for joining the resin material substrate and the support substrate to each other
Data Source
AI summary
A waveguide device is configured to guide an electromagnetic wave having a frequency of 30 GHz or more and 20 THz or less. The waveguide device includes: a resin material substrate; a conductor layer provided on the resin material substrate; and a support substrate positioned on a side opposite from the conductor layer with respect to the resin material substrate. The resin material substrate and the support substrate are directly joined to each other.