Optical Wiring Substrate with Low-Expansion Support Plate
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Solution Overview
Problem
Existing optical component mounting substrates face challenges in achieving efficient optical coupling between optical waveguides and components due to positional displacement caused by thermal expansion, leading to reduced coupling efficiency.
Innovation Solution
A wiring substrate with an optical wiring part that includes a support plate with a lower thermal expansion coefficient than the optical waveguide, allowing for precise positioning and reduced displacement, thereby enhancing optical coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the optical waveguide is mounted directly on the electrical wiring part, then the device complexity is reduced, but positional displacement occurs due to thermal expansion mismatch, reducing optical coupling efficiency
Solution Approach 1:
A support plate is introduced as an intermediary component between the electrical wiring part and the optical waveguide. This support plate serves as a mediator that provides a stable mounting surface with appropriate thermal expansion properties, preventing direct thermal interaction between the electrical wiring part and the optical waveguide, thereby maintaining optical coupling efficiency while adding minimal structural complexity
Solution Approach 2:
The thermal expansion coefficient of the support plate is specifically selected to be lower than that of the optical waveguide. This parameter change in the support plate's material properties compensates for the thermal expansion mismatch between the electrical wiring part and the optical waveguide, preventing positional displacement and maintaining reliable optical coupling under temperature variations
2Reliability
If a support plate with lower thermal expansion coefficient is used, then optical coupling stability is improved, but the device complexity increases
Solution Approach 1:
The support plate functions as a specialized intermediary layer that isolates the optical waveguide from thermal variations in the electrical wiring part. By positioning this support plate directly beneath the optical waveguide, the design achieves thermal decoupling with minimal additional components, maintaining simplicity while improving stability
Solution Approach 2:
The support plate provides localized thermal management specifically at the optical waveguide mounting area. Rather than redesigning the entire substrate, the solution applies a locally optimized component with specific thermal properties only where needed, minimizing overall device complexity while achieving the desired optical coupling stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a support plate with a lower thermal expansion coefficient helps maintain efficient optical coupling between the optical waveguide and components, even under temperature changes, improving overall coupling efficiency and stability.
Implementation Method 1
the support plate has a thermal expansion coefficient that is lower than a thermal expansion coefficient of the optical waveguide
Data Source
AI summary
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part formed on a surface of the electrical wiring part and including a support plate and an optical waveguide formed on the support plate. The optical wiring part is formed such that the optical waveguide includes at least one core part that transmits light and a cladding part surrounding the at least one core part and that the support plate has a thermal expansion coefficient that is lower than a thermal expansion coefficient of the optical waveguide.