Waveguide Test Socket for High Frequency Microcircuit Testing
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Solution Overview
Problem
Current microcircuit test equipment faces challenges in making accurate, non-destructive electrical contact with closely spaced contacts, particularly at high frequencies, leading to incorrect identifications of defective devices and signal losses, and struggles with RF port access and shielding.
Innovation Solution
A test socket with a housing and elastomeric biasing compliance member that allows for resilient contact with high-frequency wave ports, combined with a waveguide interface system using RF horn antennas to minimize RF leakage and crosstalk, enabling reliable testing of microcircuits with RF ports located on the bottom side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional test equipment is used to make electrical contact with microcircuit contacts, then testing can be performed, but accurate and non-destructive contact is difficult due to small contact size and spacing, leading to incorrect defect identification
Solution Approach 1:
The test equipment uses a grid array probe card with multiple individually controllable probe elements that can be selectively activated to contact specific microcircuit pads. This segmentation allows precise targeting of each contact point independently, improving contact accuracy and reducing false defect identification.
Solution Approach 2:
The patent replaces conventional mechanical contact methods with a combination of precision positioning systems and controlled electrical contact mechanisms. The use of automated probe card positioning and selective electrical contact reduces mechanical errors and improves measurement precision.
2Speed
If high frequency testing is performed with conventional equipment, then testing capability is provided, but signal losses occur and shielding of HF ports is problematic
Solution Approach 1:
The patent introduces waveguide structures as intermediary components between the high frequency signal source and the device under test. These waveguides provide low-loss signal transmission paths and integrated shielding, reducing signal loss and interference at high frequencies.
Solution Approach 2:
The patent uses conductive shielding films and waveguide walls to contain and direct high frequency signals. These thin conductive structures provide effective electromagnetic shielding while maintaining signal integrity and reducing energy loss.
3Adaptability or versatility
If RF ports are located on the bottom side of the IC, then integration is improved, but access to ports is occluded by the test housing and load board
Solution Approach 1:
The patent employs three-dimensional waveguide structures that extend vertically to access bottom-side RF ports. By utilizing the vertical dimension and designing the test housing with open bottom access, the system can reach ports located on the bottom surface without occlusion.
Solution Approach 2:
The patent uses nested waveguide structures where inner waveguides are positioned within outer housings, allowing access to bottom-side ports while maintaining shielding. The waveguide insert extends through the housing structure to reach the RF ports on the device under test.
4Productivity
If closely spaced microcircuit contacts are tested, then device complexity is handled, but small errors in contact alignment cause incorrect connections
Solution Approach 1:
The patent implements preliminary alignment features on the probe card and test housing, such as precision registration marks and mechanical alignment pins, that establish accurate contact alignment before testing begins. This preliminary positioning prevents alignment errors during the actual contact process.
Solution Approach 2:
The patent uses precision-adjustable mechanical parameters of the probe card positioning system to achieve and maintain accurate alignment with closely spaced contacts. By controlling positional parameters with high precision, the system maintains reliable contact alignment despite small variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable, non-destructive testing of microcircuits at high frequencies with reduced signal losses and improved RF shielding, preventing false defect identifications and enabling efficient testing of multiple devices in an array configuration.
Implementation Method 1
a HF shielding elastomeric biasing compliance member positioned to bias said insert portion resiliently into said port on the DUT
Implementation Method 2
Waveguide integrated circuit testing
Data Source
AI summary
A structure and method for providing a housing which includes a high frequency (HF or RF) connection between a device under test (DUT) having a waveguide 22. The waveguide includes a wave insert 22, and a conductive compliant member 40 which maintains bias between the adapter/insert 22 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT waveport. A passage 50 provides an RF connection between the RF port 62 on the DUT and a RF wave guide horn 54. A plurality of transmitting horns 54 can be arranged to transmit to a single receiving horn 154 so that fewer receivers are required to test multiple DUTs in sequence.