Solderable Waveguide Antenna With Thermal Thru-Holes for PCB Mounting
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Solution Overview
Problem
Conventional methods for attaching RF waveguide antennas to printed circuit boards (PCBs) often fail to provide a cost-effective and precise mechanical bonding with proper alignment and standoff heights, lacking in secure and efficient electrical sealing and heat conduction.
Innovation Solution
A solderable RF waveguide antenna with metallic portions deposited on a plastic body, using solder balls for precise alignment and solder within thru holes for heat conduction, allowing for secure mechanical bonding and electrical sealing by melting the solder balls to affix the waveguide to the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws or pressure sensitive adhesives are used to affix waveguides to PCBs, then the waveguides can be attached to the PCBs, but the attachment is not cost effective and/or precise in terms of alignment and standoff heights
Solution Approach 1:
The patent replaces conventional mechanical attachment methods (screws, pressure sensitive adhesives) with a soldering-based attachment system. The waveguide includes solderable metallic portions that are soldered to corresponding metallic portions on the PCB, transitioning from mechanical/fastening-based attachment to metallurgical bonding. This substitution achieves both precision (through solder joint accuracy) and cost-effectiveness (through simplified assembly processes).
Solution Approach 2:
The patent changes the attachment mechanism from mechanical (screws, adhesives) to metallurgical (solder joints). By modifying the bonding parameter from mechanical interference or adhesive bonding to solder melting and solidification, the system achieves improved precision in alignment and standoff height while reducing manufacturing complexity and cost.
2Manufacturing precision
If conventional attachment methods are used, then waveguides can be affixed to PCBs, but proper alignment and standoff heights of apertures relative to PCBs are not achieved
Solution Approach 1:
The patent replaces complex mechanical alignment and fastening systems with a soldering-based attachment system. The solderable metallic portions on the waveguide align with and are soldered to corresponding metallic portions on the PCB, providing precise aperture alignment through the inherent accuracy of solder joint formation without requiring complex mechanical alignment mechanisms.
3Manufacturing precision
If solder balls are used for mechanical bonding, then precise alignment is achieved, but heat conduction may be insufficient
Solution Approach 1:
The patent merges the alignment function and heat conduction function into a single integrated solution. The solder balls serve dual purposes: providing precise mechanical alignment and bonding between the waveguide and PCB, while simultaneously establishing thermal conduction pathways. This eliminates the need for separate heat dissipation mechanisms and ensures both positioning accuracy and effective heat transfer.
Solution Approach 2:
The solder joints are designed to perform multiple functions simultaneously: mechanical bonding, precise alignment, and heat conduction. This multi-functionality resolves the contradiction by making the same component (solder) responsible for both precision positioning and thermal management, eliminating the trade-off between alignment precision and heat conduction capability.
4Ease of manufacture
If plastic waveguide body is used, then cost is reduced, but electrical sealing and heat conduction are compromised
Solution Approach 1:
The patent employs a composite structure combining plastic and metal materials. The waveguide body is made of cost-effective plastic material, while solderable metallic portions are attached to specific locations on the plastic body. This composite approach maintains the cost advantage of plastic construction while adding the electrical sealing and heat conduction capabilities of metal through the solder joints at critical interfaces.
Solution Approach 2:
The patent applies metal properties (electrical sealing and heat conduction) only where needed rather than making the entire waveguide metallic. The solderable metallic portions are strategically placed at the attachment interfaces with the PCB, providing localized electrical sealing and heat conduction functionality while the majority of the waveguide body remains as cost-effective plastic material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves cheap, precise, and secure mechanical bonding with improved heat conduction and electromagnetic interference shielding, ensuring proper alignment and electrical isolation of the waveguide aperture relative to the PCB port.
Implementation Method 1
solder within thru holes for heat conduction
Implementation Method 2
applying heat to the PCB or the plastic waveguide effective to melt the solder balls and affix the plastic waveguide to the PCB
Implementation Method 3
solder disposed between the waveguide metallic portions and the PCB metallic portions
Data Source
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AI summary
Described herein is a waveguide that is configured to be soldered to a printed circuit board (PCB) via one or more metallic portions disposed thereon. Additionally, the waveguide may have solder disposed within thru holes that is configured to conduct heat from one or more components of the PCB when the waveguide is mounted to the PCB. Also described herein is an assembly comprising the waveguide soldered to the PCB via solder between the metallic portions of the waveguide and metallic portions of the PCB. Techniques for producing the waveguide and the assembly are also described herein. By soldering the waveguide to the PCB, an inexpensive, precise, and secure mechanical bonding may be achieved while electrically sealing features of the waveguide and/or components of the PCB. Furthermore, the solder within the thru holes allows for better heat conduction through the waveguide.