Waveguide Display Substrate Thickness Bias for Uniform Light Propagation

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Solution Overview

Problem

Unintended thickness variations in waveguide display substrates lead to image quality issues such as color non-uniformity and luminance variations, which are exacerbated as thickness variations approach zero, due to random shape differences and path length discrepancies affecting light propagation.

Innovation Solution

Implementing a biased total thickness variation (TTV) with a consistent thickness shape, characterized by a combination of wedge and dome components, controlled through Zernike polynomial coefficients, to minimize part-to-part variations and enhance luminance and color uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional manufacturing processes are used for waveguide display substrates, then production cost and complexity are reduced, but thickness variations and image quality deteriorate

Engineering Contradiction:
Improvethickness uniformityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-compensating for expected thickness variations during the molding process. A thickness compensation pattern is integrated into the master mold, which proactively counteracts known deformation tendencies of the molding process, thereby achieving ultra-low TTV without requiring complex post-processing steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent employs parameter changes by systematically adjusting multiple molding parameters including injection pressure, temperature profiles, and mold design features. These parameter optimizations enable precise control over polymer固化过程中的收缩和变形, achieving consistent thickness uniformity across large substrate areas.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If thickness variations are reduced to improve image quality, then luminance and color uniformity improve, but manufacturing precision requirements increase

Engineering Contradiction:
Improveimage quality consistencyVSAvoidthickness control precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by implementing spatially varying thickness compensation patterns tailored to specific regions of the substrate. The compensation pattern is not uniform but rather locally optimized based on the expected deformation behavior in different areas, allowing precise control of thickness uniformity across the entire large-area substrate.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs feedback mechanisms through iterative measurement and adjustment of the compensation pattern. Prototype substrates are manufactured, measured for actual thickness variations, and the compensation pattern is refined based on this feedback data, progressively achieving the target TTV specifications.

Inventive Principle:
Principle #23Feedback

3Area of stationary object

If large area substrates are manufactured, then display field of view increases, but thickness variations and image quality worsen

Engineering Contradiction:
Improvesubstrate areaVSAvoidthickness uniformity
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by dividing the large substrate area into multiple zones, each with its own optimized compensation parameters. This allows the complex deformation behavior across large areas to be managed through localized control strategies, maintaining thickness uniformity even as substrate area increases.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent addresses the two-dimensional challenge of large area uniformity by introducing a third dimension through controlled thickness variation compensation. The compensation pattern operates in the thickness dimension to counteract the spreading of variations across the large planar area, enabling FOV expansion without sacrificing image quality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The biased TTV approach improves image quality by ensuring consistent light propagation and reduced variations, resulting in enhanced luminance and color uniformity across waveguide displays.

Implementation Method 1

waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS20260093069A1Biased total thickness variations in waveguide display substrates
Publication Date: 2026.04.02 MAGIC LEAP INC
  • US20260093069A1 patent drawing
  • US20260093069A1 patent drawing
  • US20260093069A1 patent drawing

AI summary

A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height Dt of the curved portion is 10−7 to 10−6 times the diameter, D is between about 70% and about 130% of Dt, and W is less than about 30% of Dt.