Transmission Line to Waveguide Transition via Vertical Vias
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Solution Overview
Problem
Conventional interconnects for connecting transmission lines to waveguides are reflective to millimeter wave signals, occupy valuable lateral space, are fragile, and costly, making them unsuitable for emerging millimeter wave electronically scanned arrays.
Innovation Solution
A transition system from a planar substrate/chip circuit microwave transmission line to waveguide transmission media is developed, utilizing a substrate structure with a ground plane and vias to connect the transmission lines without occupying lateral space, enabling efficient signal transfer within tight grid spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional interconnects are used to connect transmission line to waveguide, then connection is achieved, but lateral area is occupied and inductance is large causing signal reflection
Solution Approach 1:
The patent transitions from lateral interconnection to vertical interconnection by moving the connection path from the horizontal plane to the vertical dimension. The transmission line is connected to the waveguide through a vertical via structure that passes through the substrate, eliminating the need for lateral space while reducing inductance through the shortened current path.
Solution Approach 2:
The patent introduces an intermediary transmission line structure that bridges the transmission line and waveguide through the substrate. This intermediary structure includes a first transmission line on the front surface, a via connecting through the substrate, and a second transmission line on the back surface, creating a continuous conductive path that eliminates signal reflection while saving lateral space.
2Reliability
If conventional interconnects are used, then connection is achieved, but the structure is fragile and costly
Solution Approach 1:
The patent merges the interconnect function with the substrate structure itself. The via structure is integrated directly into the substrate during manufacturing, and the transmission lines are formed as part of the substrate's conductive layers. This integration eliminates separate fragile interconnect components and reduces manufacturing steps, thereby improving robustness and reducing cost.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical connection pathways through vias, and transmission line structures. The substrate's own conductive layers and structural integrity are utilized to create the interconnect, eliminating the need for additional fragile components and simplifying manufacturing.
3Area of stationary object
If tight grid spacing is required for MMW ESAs, then space is saved, but conventional interconnects cannot be used due to lateral area requirements
Solution Approach 1:
The patent enables tight grid spacing by relocating the interconnect path from the lateral dimension to the vertical dimension. The via structure allows transmission lines to connect through the substrate thickness rather than extending laterally, making the interconnect compatible with the tight grid spacing requirements of millimeter-wave electronically scanned arrays.
Data Source
AI summary
In one aspect, an embodiment of the invention provides a transition from a planar substrate/chip circuit microwave transmission line to waveguide transmission media on the back of the substrate/chip. The transition enables planar waveguide fed MMW ESA architectures to be realized within the tight grid spacing required for emerging MMW ESAs.