Waveguide Dielectric Void Structure for Optical Leakage Isolation
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently transferring optical signals while preventing signal leakage into the substrate, due to structural limitations that can cause misalignment and reduced signal transfer.
Innovation Solution
The semiconductor device incorporates a waveguide over a substrate with a first dielectric structure and a second dielectric structure, where the second dielectric structure inhibits the removal of a portion of the substrate, creating a void that prevents signal leakage and provides structural support to maintain alignment of the waveguide with optical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a waveguide is formed over a substrate without a void structure, then the device structure is simpler, but optical signal leakage into the substrate occurs and alignment with optical components is reduced
Solution Approach 1:
The substrate is segmented into two portions: a first portion that remains to provide structural support and a second portion that is removed to form a void. This segmentation allows the waveguide to be isolated from the substrate in the vertical direction, preventing optical signal leakage while maintaining structural integrity through the remaining first portion of the substrate.
Solution Approach 2:
A dielectric structure is introduced as an intermediary between the waveguide and the substrate. This dielectric structure fills the space where the second portion of the substrate was removed, providing both structural support and optical isolation to prevent signal leakage into the substrate while maintaining alignment with optical components.
2Reliability
If the second portion of the substrate is removed to create a void, then signal leakage is prevented, but structural support may be compromised
Solution Approach 1:
The substrate is divided into a first portion and a second portion. The second portion is removed to create a void that prevents optical signal leakage, while the first portion is retained to provide necessary structural support for the waveguide and overall device integrity.
Solution Approach 2:
A dielectric structure is placed as an intermediary to fill the void created by removing the second portion of the substrate. This dielectric structure provides both optical isolation to prevent signal leakage and structural support to maintain device integrity.
3Productivity
If the waveguide is aligned with optical components, then signal transfer efficiency is improved, but misalignment occurs without proper structural support
Solution Approach 1:
A dielectric structure is introduced as an intermediary between the waveguide and the substrate to provide precise structural support and alignment features. This dielectric structure ensures accurate alignment between the waveguide and optical components, enabling efficient signal transfer while maintaining manufacturing precision.
Solution Approach 2:
The dielectric structure is formed in advance during the fabrication process to establish precise alignment features before final assembly with optical components. This preliminary structuring ensures that the waveguide is pre-aligned with the correct orientation and position for optimal signal transfer efficiency.
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a waveguide over a substrate. The semiconductor device includes a first dielectric structure over the substrate, wherein a portion of the waveguide is in the first dielectric structure. The semiconductor device includes a second dielectric structure under the waveguide, wherein a first sidewall of the second dielectric structure is adjacent a first sidewall of the substrate.