Wavelength Conversion Assembly Welding for High-Temperature Reliability
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Solution Overview
Problem
Existing methods for assembling phosphor wheels in projection apparatuses using adhesive materials are not suitable for high-power applications due to temperature sensitivity, leading to deterioration and increased production costs, as these materials are not resistant to high temperatures and have long curing times.
Innovation Solution
A manufacturing method for a wavelength conversion assembly that uses a first welding structure to connect a substrate and a first element, providing a heat-insulating effect and allowing the assembly to withstand high temperatures, reducing the risk of deterioration and pollution, while also shortening the process time and lowering production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive material is used to bond substrate and motor in phosphor wheel, then assembly is simple, but adhesive deteriorates at high temperature causing burnout and pollution
Solution Approach 1:
The patent changes the bonding method from adhesive-based to welding-based, fundamentally altering the physical-chemical parameters of the joining process. Welding creates a metallurgical bond that can withstand high temperatures without deterioration, eliminating the temperature threshold limitation of adhesive materials while maintaining assembly effectiveness.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a thermal-metallurgical bonding mechanism (welding). This substitution eliminates the organic material degradation issue at high temperatures by using a process that creates a permanent, heat-resistant joint between the substrate and motor components.
2Reliability
If high-temperature-resistant adhesive material is used, then temperature resistance is improved, but curing time is extended increasing production costs
Solution Approach 1:
The patent replaces chemical curing processes with thermal welding processes. Welding achieves bond formation through localized melting and solidification, which occurs rapidly under controlled heat application, eliminating the extended curing times required by high-temperature-resistant adhesive materials while maintaining heat resistance.
Solution Approach 2:
The welding process allows the bonding operation to be completed rapidly by concentrating energy delivery in a short time frame. The intense localized heat quickly melts and fuses the materials, then rapid cooling solidifies the joint, skipping the prolonged chemical reaction time required by adhesive curing processes.
3Strength
If substrate fully contacts first element, then connection strength is improved, but heat insulation effect is reduced
Solution Approach 1:
The welding structure implements local quality by concentrating the bonding function in specific localized zones rather than requiring full-surface contact. The welded joints provide sufficient connection strength at discrete points while leaving other areas open for heat insulation, optimizing both mechanical strength and thermal management.
Solution Approach 2:
The patent segments the bonding interface into discrete welded joints rather than continuous contact. This segmentation allows the structure to achieve adequate mechanical strength through strategically placed bonds while maintaining thermal isolation between the substrate and first element in non-bonded regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the service life of the wavelength conversion assembly by preventing mass loss and pollution in high-temperature environments, reduces production costs, and improves process flexibility by using a welding structure that is more resistant to high temperatures than traditional adhesives.
Implementation Method 1
a first welding structure is formed between the first portion of the substrate and the first element, and the first welding structure partially connects the first portion and the first element as a whole
Implementation Method 2
the substrate partially contacts the first element only, so that a favorable heat insulating effect is provided
Data Source
AI summary
A manufacturing method of a wavelength conversion assembly is provided. The method includes steps of: arranging a first element on a first portion of a substrate; forming a first welding structure between the first portion of the substrate and the first element, wherein the first welding structure partially connects the first portion and the first element as a whole; and arranging a wavelength conversion layer on a second portion of the substrate, wherein the second portion of the substrate surrounds the first portion of the substrate. The first welding structure may withstand high temperatures. In this way, the first welding structure may not pollute other elements in a high temperature and high humidity environment, and service life of the wavelength conversion assembly is thereby increased.