Wavelength Conversion Device Adhesive Layer Thickness Control
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Solution Overview
Problem
The existing wavelength conversion devices using non-linear optical crystals with periodic polarization inversion structures face issues of significant output deviation and reduced efficiency due to adhesive layer burning and micro irregularities, leading to unstable operation and reduced output power.
Innovation Solution
A wavelength conversion device is designed with a Z-plate of lithium niobate doped with magnesium oxide, featuring a periodic domain inversion structure, a buffer layer, and an organic resin adhesive layer with a thickness between 0.6 μm and 2.0 μm to stabilize the output and prevent adhesive layer failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin adhesive layer is used to adhere the wavelength conversion substrate onto a supporting body, then the substrate can be securely mounted, but the adhesive layer may burn out due to laser irradiation causing adhesion failure
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thickness of the resin adhesive layer within the range of 0.6 μm to 2.0 μm. This thickness parameter optimization prevents the adhesive layer from burning out during laser irradiation while maintaining sufficient adhesion strength, thereby resolving the contradiction between adhesion strength and adhesion reliability.
2Reliability
If the resin adhesive layer is made thinner to prevent burning, then adhesion reliability improves, but manufacturing precision becomes more difficult to control
Solution Approach 1:
The patent defines a specific thickness range (0.6 μm to 2.0 μm) for the resin adhesive layer that balances adhesion reliability and manufacturing precision. This parameter specification provides clear manufacturing targets while ensuring reliable operation, resolving the contradiction between reliability and manufacturing precision.
3Strength
If the resin adhesive layer is made thicker to ensure adequate adhesion, then adhesion strength improves, but the adhesive layer burns out under laser irradiation
Solution Approach 1:
The patent optimizes the adhesive layer thickness parameter to fall within 0.6 μm to 2.0 μm, which provides sufficient adhesion strength while preventing laser-induced burning. This parameter control resolves the contradiction between adhesion strength and resistance to laser-induced harmful effects.
4Productivity
If a periodic domain inversion structure is formed in the substrate to improve wavelength conversion efficiency, then conversion efficiency improves, but micro irregularities cause output deviation
Solution Approach 1:
The patent introduces a buffer layer as an intermediary between the wavelength conversion substrate and the resin adhesive layer. This buffer layer mediates the micro irregularities caused by the periodic domain inversion structure, preventing them from causing output deviation while maintaining high conversion efficiency, thus resolving the contradiction between productivity and reliability.
5Reliability
If the substrate thickness is reduced to minimize micro irregularities, then output stability improves, but connection efficiency of the fundamental wave decreases
Solution Approach 1:
The patent optimizes the substrate thickness parameter within the range of 10 μm to 100 μm, which balances output stability and connection efficiency. This parameter optimization resolves the contradiction between reliability and productivity by finding the optimal thickness range that satisfies both requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a stable high output of wavelength-converted light by minimizing optical loss and preventing adhesive layer burning, maintaining efficient operation and improving connection efficiency of the fundamental wave.
Implementation Method 1
A periodic domain inversion structure formed in a slab type optical waveguide made of a non-linear optical crystal to generate second harmonic wave
Implementation Method 2
an organic resin adhesive layer adhering the supporting body and the buffer layer
Data Source
AI summary
A wavelength conversion device includes a supporting body, a wavelength conversion substrate of a Z-plate of a ferroelectric single crystal with a periodic domain inversion structure formed therein and having a thickness “T” of 10 μm or more and 100 μm or less, a buffer layer provided on a bottom face of the wavelength conversion substrate, and an organic resin adhesive layer adhering the supporting body and buffer layer with a thickness of 0.6 μm or more and 2.0 μm or less.