Wavelength Conversion Module Boss Structure for Heat Dissipation
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Solution Overview
Problem
Existing phosphor wheels face challenges with heat dissipation and material limitations, leading to reduced excitation efficiency and reliability due to the use of metal or ceramic substrates that cannot withstand high sintering temperatures or are prone to cracking.
Innovation Solution
A wavelength conversion module design featuring adhesive bosses on the substrate, separate from the wavelength conversion layer, which enhances heat dissipation, increases toughness, and balances weight, using materials with high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If boss structures are formed on the heat dissipation substrate to increase heat dissipation efficiency, then heat dissipation efficiency is improved, but the strength of the substrate is reduced
Solution Approach 1:
The patent applies local quality by creating boss structures only in specific regions of the substrate where heat dissipation is most needed, while maintaining the overall structural integrity. The boss structures are strategically positioned to enhance heat dissipation locally without compromising the global strength of the substrate.
Solution Approach 2:
The patent introduces a vertical dimension by creating three-dimensional boss structures protruding from the substrate surface. This dimensional change increases the effective heat dissipation surface area without significantly affecting the overall substrate strength, as the bosses are integrated into the substrate structure rather than being separate attachments.
2Temperature
If high-temperature inorganic glue is used to sinter phosphor powder onto the heat dissipation substrate, then sintering temperature is increased, but the metal substrate cannot withstand such temperature
Solution Approach 1:
The patent employs composite materials by combining metal substrate with ceramic or other high-temperature resistant materials in the boss structure regions. This composite construction allows the substrate to withstand the high sintering temperatures required for inorganic glue while maintaining the thermal conductivity benefits of metal materials in other areas.
3Temperature
If ceramic substrate is used as heat dissipation substrate to withstand high temperature, then temperature resistance is improved, but heat dissipation effect is poor and the substrate is brittle
Solution Approach 1:
The patent uses composite materials combining ceramic and metal components. The ceramic portions provide high-temperature resistance for sintering operations, while the metal portions maintain excellent thermal conductivity for heat dissipation. This composite structure resolves the contradiction between temperature resistance and heat dissipation effectiveness.
Solution Approach 2:
The patent applies local quality by using ceramic materials specifically in regions requiring high-temperature resistance (such as boss structures for phosphor attachment) while using metal materials in regions requiring optimal heat dissipation. This localized material selection optimizes both temperature resistance and heat dissipation performance.
4Loss of energy
If the number and height of boss structures are increased to enhance heat dissipation, then heat dissipation efficiency is improved, but the substrate strength is further reduced
Solution Approach 1:
The patent applies partial action by creating boss structures with optimized dimensions and distribution. Rather than maximizing the number and height of bosses throughout the entire substrate, the design uses a selective approach where bosses are positioned only where heat dissipation is most critical, maintaining an optimal balance between heat dissipation enhancement and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation by 20-30% and excitation efficiency by 5-10%, while increasing the substrate's strength and reliability, resulting in better projection quality and product competitiveness.
Implementation Method 1
the adhesive bosses are configured separately from the wavelength conversion layer... increase the heat dissipation effect of the substrate when the wavelength conversion module rotates at a high speed to reduce the temperature of the wavelength conversion layer
Implementation Method 2
The wavelength conversion layer is configured on the first surface of the substrate... convert the excitation beam into a conversion beam
Data Source
AI summary
A wavelength conversion module, including a substrate, a wavelength conversion layer, and multiple adhesive bosses, is provided. The substrate has a first surface. The wavelength conversion layer is configured on the first surface of the substrate. The adhesive bosses are separately configured on the first surface of the substrate. The wavelength conversion layer surrounds the adhesive bosses, and each of the adhesive bosses is configured separately from the wavelength conversion layer. The disclosure also provides a projector including the wavelength conversion module. The wavelength conversion module has better heat dissipation effect.