Wavelength Conversion Device Polishing Discharge Prevention
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Solution Overview
Problem
Micro cracks in the optical waveguide of wavelength conversion devices occur due to abnormal discharge during polishing, leading to increased propagation loss, which has not been effectively addressed in existing technologies.
Innovation Solution
A wavelength conversion device is designed with a supporting body having lower volume resistivity than the ferroelectric single crystal substrate, and a conductive film is added on the upper side buffer layer to prevent abnormal discharge and micro cracks during polishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple devices are stacked and polished together to improve productivity, then polishing efficiency is improved, but abnormal discharge occurs between adjacent devices causing micro cracks
Solution Approach 1:
A buffer layer with intermediate resistivity (10^10 to 10^13 Ω·cm) is introduced between the high-resistivity wavelength conversion substrate and the low-resistivity supporting body. This intermediary layer prevents direct contact and abnormal discharge between adjacent stacked devices during polishing, while still allowing mechanical support and optical functionality.
Solution Approach 2:
The resistivity parameter of the buffer layer is specifically controlled to be between 10^10 to 10^13 Ω·cm, which is lower than the wavelength conversion substrate (10^14 to 10^16 Ω·cm) but higher than the supporting body (10^6 to 10^9 Ω·cm). This parameter optimization prevents discharge while maintaining structural integrity during stacked polishing.
2Object-affected harmful factors
If the supporting body has lower volume resistivity to prevent discharge, then abnormal discharge is suppressed, but the structural integrity may be compromised
Solution Approach 1:
The supporting body is designed with volume resistivity of 10^6 to 10^9 Ω·cm, significantly lower than the wavelength conversion substrate, to act as a discharge path and prevent abnormal discharge during polishing while maintaining sufficient mechanical strength through its bulk properties.
Solution Approach 2:
Different regions of the device structure are assigned different resistivity characteristics: the supporting body has low resistivity for discharge prevention, the buffer layer has intermediate resistivity for gradient transition, and the wavelength conversion substrate maintains high resistivity for optical functionality. This local differentiation resolves both discharge prevention and structural integrity requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents micro cracks and associated propagation loss in the optical waveguide, enhancing the reliability and efficiency of the wavelength conversion process.
Implementation Method 1
due to piezoelectric effect during the polishing, abnormal discharge is generated between the upper face of the wavelength conversion substrate of one device and the lower face of the supporting body of the adjacent device
Implementation Method 2
prevent the micro cracks in the optical waveguide due to pyroelectric effect caused by the polishing of the end face of the device
Data Source
AI summary
A wavelength conversion device has a supporting body, a wavelength conversion substrate, a lower side buffer layer provided on the side of a bottom face of the substrate, a upper side buffer layer provided on the side of a upper face of the substrate, and an adhesive layer adhering the supporting body 8 and the lower side buffer layer. The wavelength conversion substrate is made of a Z-plate of a ferroelectric single crystal and a periodic polarization inversion structure formed therein. The supporting body has a volume resistivity lower than that of the ferroelectric single crystal of the wavelength conversion substrate.