Wavelength Conversion Element Heat Dissipation via Segmented Reflection
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Solution Overview
Problem
The existing light source apparatuses face challenges in efficiently dissipating heat from the phosphor layer to the substrate, leading to decreased fluorescence conversion efficiency and yield due to the placement of the reflection layer across the phosphor layer's surface, and the dicing process can cause separation of the reflection layer from the phosphor layer, further reducing manufacturing efficiency.
Innovation Solution
A wavelength conversion element configuration where a reflection member with an inorganic oxide layer is placed on one surface, and a bonding material and first layer are used on the opposing surface to facilitate heat dissipation to the base, improving thermal conductivity and preventing separation during the dicing process by extending the first layer from the reflection member's side surface to the bonding area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflection layer is provided across the surface of the phosphor layer facing the substrate, then light reflection efficiency is improved, but heat dissipation from the phosphor layer to the substrate deteriorates
Solution Approach 1:
The reflection layer is divided into multiple regions: a first region facing the phosphor layer for light reflection, and a second region extending to the side surface and bonding area for heat dissipation. This segmentation allows different portions of the reflection layer to serve different functions - light reflection and heat dissipation simultaneously.
Solution Approach 2:
The reflection layer is designed to perform multiple functions: it reflects light in the first region while simultaneously serving as a heat dissipation path in the second region that extends to the side surface and bonding area. This multi-functionality resolves the contradiction between light reflection efficiency and heat dissipation efficiency.
2Productivity
If the phosphor substrate is cut into parts during dicing process, then individual wavelength conversion elements are obtained, but the reflection layer separates from the phosphor layer
Solution Approach 1:
The reflection layer is preliminarily extended to cover the side surface and bonding area before the dicing process. This preliminary extension ensures that when the substrate is cut, the reflection layer remains bonded to the phosphor layer at the bonding area, preventing separation during and after the dicing process.
Solution Approach 2:
The reflection layer is extended from a two-dimensional plane into the third dimension by covering the side surface of the phosphor layer. This dimensional extension creates a physical barrier that prevents separation at the bonding interface during the dicing process, maintaining bonding integrity while enabling individual element production.
3Manufacturing precision
If phosphor layers are placed individually in a film formation apparatus, then reflection layers can be formed on each layer, but manufacturing efficiency decreases
Solution Approach 1:
Multiple wavelength conversion elements are manufactured simultaneously on a single phosphor substrate. The reflection layer is formed once across the entire substrate, covering multiple phosphor layers at their bonding areas. This merging approach maintains high manufacturing precision while significantly improving productivity by eliminating the need to process each layer individually.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation and maintains high-illuminance light production by reducing temperature-related efficiency losses and minimizing yield decreases due to separation issues during manufacturing.
Implementation Method 1
the reflection member including an inorganic oxide layer and reflecting the excitation light and the converted light
Implementation Method 2
a wavelength conversion layer... the wavelength conversion layer wavelength-converting the excitation light into converted light having a wavelength different from a wavelength of the excitation light
Implementation Method 3
In the second region, the wavelength conversion layer is bonded to the base via the first layer and the bonding material, whereby heat in the wavelength conversion layer is efficiently dissipated toward the base via the first layer and the bonding material
Data Source
AI summary
The invention relates to a wavelength conversion element including a wavelength conversion layer having a first surface including an excitation light irradiated region irradiated with excitation light and a second surface being opposed to the first surface, the wavelength conversion layer wavelength-converting the excitation light into converted light having a wavelength different from the wavelength of the excitation light, a reflection member provided on a portion of the second surface, the reflection member including an inorganic oxide layer and reflecting the excitation light and the converted light, a first layer disposed in a first region that faces the reflection member and in a second region that does not face the reflection member on the second surface of the wavelength conversion layer, a bonding material so provided as to face the first layer, and a base bonded to the first layer via the bonding material.