Wavelength Conversion Module Inorganic Bonding Thermal Management

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Solution Overview

Problem

Existing phosphor wheels in projection devices face issues with thermal resistance and reliability due to the degradation of silicone-based materials and the formation of holes during the sintering process, which affects light emitting efficiency and longevity.

Innovation Solution

A wavelength conversion module is developed with a substrate and a wavelength conversion layer that includes a wavelength conversion material dispersed in an inorganic bonding material, featuring first holes filled with a first filling adhesive material to enhance thermal conductivity and heat resistance, and a reflective layer with a scattering material and second filling adhesive material to reduce hole volume and improve reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If silicone-based bonding material is used in the wavelength conversion layer, then the manufacturing process is simple and easy to operate, but the thermal conductivity and heat resistance are poor, leading to degradation under laser irradiation

Engineering Contradiction:
Improveease of manufactureVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material parameter from organic silicone-based bonding material to inorganic bonding material, which fundamentally alters the thermal conductivity and heat resistance properties while maintaining the manufacturing process simplicity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining inorganic bonding material with wavelength conversion material (phosphor powder) to create a wavelength conversion layer that achieves both good thermal conductivity and high conversion efficiency, resolving the contradiction between ease of manufacture and reliability

Inventive Principle:
Principle #40Composite materials

2Reliability

If inorganic bonding material is used to replace silicone, then thermal conductivity and heat resistance are improved, but holes are formed during sintering or curing process, reducing conversion efficiency

Engineering Contradiction:
ImprovereliabilityVSAvoidmanufacturing precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent intentionally creates a controlled porous structure with voids in the wavelength conversion layer, where the voids occupy 5-50% of the total volume. This porous structure allows the inorganic bonding material to maintain good thermal conductivity while accommodating the shrinkage and hole formation during sintering, thus resolving the contradiction between reliability and manufacturing precision

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The patent optimizes the particle size ratio of inorganic bonding material to wavelength conversion material (1:2 to 1:5) and controls the void volume percentage (5-50%) to achieve the best balance between thermal conductivity and conversion efficiency, preventing excessive hole formation while maintaining structural integrity

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If phosphor powder is coated with silicone-based mixture, then the manufacturing process is simple, but the light emitting efficiency deteriorates due to degradation of silicone under long-time laser irradiation

Engineering Contradiction:
Improveease of manufactureVSAvoidlight emitting efficiency
Core Design Contradiction:
Ease of manufactureVSUse of energy by moving object

Solution Approach 1:

The patent changes the bonding material from organic silicone to inorganic material, which has superior thermal stability and resistance to laser irradiation. This parameter change prevents degradation under long-time laser exposure while maintaining ease of manufacture through simple coating processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses inexpensive inorganic bonding materials such as glass adhesive or ceramic materials that can withstand high temperatures and laser irradiation without degrading, replacing the short-lived silicone-based materials that deteriorate under thermal stress

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved thermal conductivity, heat resistance, and reliability of the wavelength conversion module, ensuring high conversion efficiency and extended lifespan, thereby enhancing the performance and reliability of the projection device.

Implementation Method 1

phosphor powder has been excited by an excitation light source to generate a solid color light source

Methodology Applied
Scientific EffectPhotoluminescence: Photoluminescence

Implementation Method 2

The wavelength conversion layer includes a wavelength conversion material, a first bonding material, and a first filling adhesive material... the inorganic adhesive material and phosphor or the reflective material to form the phosphor wheel. The phosphor wheel formed by applying this manufacturing process has better thermal conductivity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a reflective layer with a scattering material and second filling adhesive material

Methodology Applied
Scientific EffectLight scattering: Scattering

Data Source

PatentUS10854791B2Wavelength conversion module, method for forming wavelength conversion module, and projection device
Publication Date: 2020.12.01 CORETRONIC CORPORATION
  • US10854791B2 patent drawing
  • US10854791B2 patent drawing
  • US10854791B2 patent drawing

AI summary

A wavelength conversion module, a method for forming a wavelength conversion module, and a projection device are provided. The wavelength conversion module includes a substrate and a wavelength conversion layer. The wavelength conversion layer is located on the substrate and has a plurality of first holes. The wavelength conversion layer includes a wavelength conversion material, a first bonding material, and a first filling adhesive material. The wavelength conversion material is dispersed in the first bonding material. The first filling adhesive material is configured to fill at least a portion of the first holes. The projection device includes the wavelength conversion module, an excitation light source, a light valve, and a projection lens. The wavelength conversion module provided herein has good conversion efficiency and reliability.