Intermediate Layer for Wavelength Conversion Heat Dissipation

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Solution Overview

Problem

Devices for converting electromagnetic radiation wavelengths face challenges with heat dissipation due to inadequate thermal conductivity between the conversion layer and the carrier, leading to potential overheating and reduced long-term stability.

Innovation Solution

Incorporating a solid intermediate layer with materials like metals, semimetals, and oxygen/nitrogen between the conversion layer and the carrier, which can include multiple layers of materials such as aluminum nitride, indium tin oxide, and aluminum oxide to enhance thermal conductivity and match coefficients of thermal expansion, while optionally using a reflective mirror layer for protection and improved reflectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conversion layer is used to convert wavelength of electromagnetic radiation, then the wavelength conversion function is achieved, but heat dissipation becomes problematic due to high heat evolution

Engineering Contradiction:

Improveheat dissipationVSAvoidlong-term stability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

An intermediate layer is introduced between the conversion layer and the carrier to improve thermal conductivity. This intermediate layer acts as a thermal bridge, conducting heat away from the conversion layer more effectively than the direct connection provided by the carrier alone, thereby improving heat dissipation while maintaining long-term stability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The intermediate layer is configured from a solid layer comprising metallic or semimetallic materials, and/or ceramic materials such as aluminum nitride, indium tin oxide, aluminum oxide, aluminum oxynitride, tantalum oxide, tantalum oxynitride, titanium dioxide, or zinc oxide. These composite materials provide high thermal conductivity while being compatible with both the conversion layer and carrier, resolving the heat dissipation issue without compromising stability.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the thermal conductivity between conversion layer and carrier is improved, then heat dissipation is enhanced, but the complexity of the device structure increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The intermediate layer is positioned directly between the conversion layer and the carrier, forming a simple three-layer structure. This intermediary approach improves thermal conductivity without requiring complex multi-component assemblies or sophisticated thermal management systems, thus enhancing heat dissipation with minimal increase in structural complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If the intermediate layer is configured as a solid layer, then thermal conductivity is improved, but the adaptation of coefficients of thermal expansion becomes more challenging

Engineering Contradiction:

Improvethermal conductivityVSAvoidcoefficient of thermal expansion adaptation

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The intermediate layer utilizes composite materials with tailored thermal expansion properties. By selecting materials such as aluminum nitride, aluminum oxide, or other ceramics and metals, the thermal expansion coefficient of the intermediate layer can be optimized to match both the conversion layer and the carrier, reducing thermal stress during temperature cycles while maintaining high thermal conductivity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The intermediate layer is designed with specific material properties localized to its position between the conversion layer and carrier. The material selection is optimized for the specific thermal and mechanical conditions at this interface, providing high thermal conductivity while having a coefficient of thermal expansion that is compatible with both adjacent layers, thus resolving the expansion mismatch issue.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves thermal conductivity and long-term stability, enabling effective heat dissipation and maintaining the device's performance over time while protecting the intermediate layer from electromagnetic radiation.

Implementation Method 1

the thermal conductivity between the conversion layer and a carrier is improved... the solid layer... achieve a higher thermal conductivity of the intermediate layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the conversion layer is configured to at least partly convert the wavelength of incident electromagnetic radiation

Methodology Applied

Scientific EffectWavelength conversion:

Implementation Method 3

good dissipation of heat from the conversion layer is advantageous... the carrier, which simultaneously serves as a heat sink

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS10520164B2Device for converting the wavelength of electromagnetic radiation

Publication Date: 2019.12.31 OSRAM OLED

AI summary

A device for converting the wavelength of electromagnetic radiation is disclosed. In an embodiment the device includes a carrier, a conversion layer configured to at least partly convert a wavelength of the electromagnetic radiation and an intermediate layer, wherein the conversion layer is connected to the carrier via the intermediate layer, and wherein the intermediate layer, at least in partial regions, includes a solid layer and a connection layer.