Wavelength Conversion Module Dynamic Wing Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In solid-state light source laser projectors, heat energy accumulation at the central substrate is hindered by adhesives, leading to thermal expansion differences between the counterweight ring and substrate, causing deformation and noise issues due to inadequate heat dissipation.
Innovation Solution
A wavelength conversion module with a substrate featuring a wavelength conversion area, non-wavelength conversion area, and through holes, where a wing dynamically adjusts to close or form airflow channels based on temperature ranges, differing thermal expansion coefficients, and an adhesive layer for fixation, enhancing heat dissipation and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a counterweight ring is assembled with the substrate using adhesive, then dynamic balance correction can be achieved, but heat energy accumulation occurs at the central substrate due to adhesive blocking heat transfer
Solution Approach 1:
The substrate is divided into a wavelength conversion area and a non-wavelength conversion area, with through holes positioned in the non-wavelength conversion area. This segmentation allows heat dissipation pathways to be created without interfering with the wavelength conversion function.
Solution Approach 2:
The wing is made of a material with a thermal expansion coefficient different from the substrate. When temperature changes, the differential thermal expansion causes the wing to move relative to the substrate, dynamically opening or closing the through holes to regulate heat dissipation.
2Stability of the object's composition
If the central substrate is covered by counterweight ring, then structural stability is improved, but heat dissipation is hindered as the central part cannot directly contact air
Solution Approach 1:
The wing acts as an intermediary element between the substrate and the environment. It dynamically controls the opening of through holes to mediate heat dissipation, allowing heat to escape when needed while maintaining structural integrity.
Solution Approach 2:
The heat dissipation structure is made dynamic through the temperature-responsive wing. The wing automatically adjusts the opening state of through holes based on temperature changes, transitioning between closed (low temperature) and open (high temperature) states to regulate heat dissipation dynamically.
3Temperature
If additional heat dissipation structure is added to the phosphor wheel, then heat energy accumulation is reduced, but weight increases and dynamic balance is affected
Solution Approach 1:
The wavelength conversion module serves multiple functions: wavelength conversion in the conversion area and temperature-responsive heat dissipation control through the wing mechanism. This multi-functionality eliminates the need for separate dedicated heat dissipation structures.
Solution Approach 2:
The system uses its own temperature changes to drive the heat dissipation mechanism. The thermal expansion difference between the wing and substrate causes the wing to automatically open or close through holes in response to temperature, creating a self-regulating heat dissipation system without external control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively reduces temperature and improves reliability by creating turbulence for better heat dissipation, while maintaining projection quality and competitiveness.
Implementation Method 1
When the substrate reaches a first temperature range, the wing closes the through hole
Implementation Method 2
When the substrate reaches a second temperature range, at least one airflow channel is formed between the wing and the through hole
Implementation Method 3
airflow channel is formed between the wing and the through hole
Implementation Method 4
creating turbulence for better heat dissipation
Implementation Method 5
creating turbulence for better heat dissipation
Data Source
AI summary
A wavelength conversion module including a substrate, a wavelength conversion layer and at least one wing is provided. The substrate has a wavelength conversion area, a non-wavelength conversion area and at least one through hole. The through hole penetrates through the substrate and is located in the non-wavelength conversion area. The wavelength conversion layer is disposed in the wavelength conversion area of the substrate. The wing is disposed in the non-wavelength conversion area of the substrate. When the substrate reaches a first temperature range, the wing closes the through hole. When the substrate reaches a second temperature range, at least one airflow channel is formed between the wing and the through hole. The wavelength conversion module of the invention and the projection device using the same effectively reduce a temperature of the wavelength conversion module, and thus have better reliability.


