Wavelength Conversion Element Sintering for Projection Devices
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Solution Overview
Problem
The existing wavelength conversion elements in projection devices face issues with adhesive overflow and subsequent scorching, leading to reduced conversion efficiency and shortened service life due to thermal expansion mismatches between the base plate and wavelength conversion layers, resulting in poor image quality and structural weakness.
Innovation Solution
The wavelength conversion layers are sintered and connected together without gaps, preventing adhesive overflow and enhancing thermal stability, while a ceramic material layer can be used to improve sintering connection and increase the effective excitation region, ensuring efficient conversion and extended service life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gaps are left between wavelength conversion layers to prevent cracking, then thermal expansion mismatch is accommodated, but adhesive material overflows and scorches reducing conversion efficiency
Solution Approach 1:
The patent changes the physical and chemical parameters of the bonding material by using a low melting point alloy (such as indium, gallium, or their alloys) instead of conventional adhesive materials. This alloy melts at temperatures below 150°C, allowing it to flow and fill gaps between wavelength conversion layers during the baking process, preventing adhesive overflow while maintaining layer integrity and preventing cracking.
Solution Approach 2:
The patent utilizes the phase transition (melting) of the low melting point alloy during the baking process. The alloy transitions from solid to liquid state at temperatures below 150°C, enabling it to flow and fill gaps between layers, then solidifies upon cooling to provide strong bonding without causing adhesive overflow or scorching issues.
2Strength
If adhesive material is used to attach wavelength conversion layers, then layers are securely bonded, but adhesive overflows and scorches reducing service life
Solution Approach 1:
The patent changes the thermal properties of the bonding material by selecting a low melting point alloy with melting temperature below 150°C. This parameter change allows the material to remain stable during laser irradiation and curing processes, preventing scorching and degradation that would otherwise reduce service life, while still providing strong bonding strength.
Solution Approach 2:
The patent uses a low melting point alloy that can be easily applied and processed, replacing conventional adhesives that require complex curing processes. The alloy provides sufficient bonding strength for the application while being thermally stable during operation, effectively extending service life without compromising bonding strength.
3Ease of manufacture
If baking process is performed to cure adhesive material, then adhesive is cured and layers are fixed, but thermal expansion mismatch causes layer cracking
Solution Approach 1:
The patent changes the curing temperature parameter by using a low melting point alloy that processes at temperatures below 150°C. This is significantly lower than conventional baking temperatures (typically 200-400°C), thereby avoiding thermal stress and cracking caused by thermal expansion mismatch while still achieving proper curing and bonding of the wavelength conversion layers.
4Productivity
If excitation beam irradiation is applied to activate wavelength conversion, then light conversion occurs, but adhesive material deteriorates and layers separate
Solution Approach 1:
The patent changes the thermal stability parameter of the bonding material by using a low melting point alloy that remains stable at the operating temperatures generated by laser irradiation. The alloy does not scorch or degrade under prolonged excitation beam exposure, preventing layer separation and maintaining structural integrity while allowing efficient light conversion to occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains high conversion efficiency and extends the service life of the wavelength conversion element, resulting in improved image quality and reliability for projection devices by eliminating adhesive-related issues and enhancing structural integrity.
Implementation Method 1
The plurality of wavelength conversion layers are sintered and connected together
Implementation Method 2
A wavelength conversion element is generally disposed on a transmission path of an excitation beam provided by the light source, so as to convert the excitation beam, such as a blue excitation beam, into another colored light, such as yellow light or green light
Data Source
AI summary
A wavelength conversion element includes a base plate and a plurality of wavelength conversion layers. The base plate has a plurality of wavelength conversion regions. The plurality of wavelength conversion layers are respectively disposed on the wavelength conversion regions. The wavelength conversion layers are sintered and connected together. The invention also provides a projection device having the wavelength conversion element and a manufacturing method of the wavelength conversion element. The wavelength conversion element of the invention can have good conversion efficiency and long service life, so that the projection device with the wavelength conversion element can provide a good image quality.