Wavelength Conversion Device Stress Isolation
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Solution Overview
Problem
Conventional wavelength conversion devices experience significant intensity decrease of wavelength converted light due to ambient temperature variations, leading to deteriorated performance across a wide temperature range.
Innovation Solution
The device includes a supporting substrate with a wavelength conversion element featuring a ridge optical waveguide, grooves on both sides, and separate portions made of ferroelectric material, where the separate portions are bonded to the substrate but separated from the waveguide, absorbing stress generated by temperature changes and shielding it from directly affecting the waveguide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the wavelength conversion element is directly bonded to the supporting substrate with adhesive layer, then the device structure is simple, but the stress from temperature variations causes phase-matched wavelength shift and intensity decrease
Solution Approach 1:
The ferroelectric substrate is divided into three parts: a central wavelength conversion element and two separate portions on both sides. The separate portions are bonded to the supporting substrate while the wavelength conversion element remains unbonded, creating stress isolation zones that prevent stress transmission to the waveguide region.
Solution Approach 2:
The wavelength conversion element is extracted from the bonded structure by removing the adhesive layer beneath it. This creates an unbonded region that is isolated from the stress generated at the bonded interfaces, allowing the conversion element to maintain stable optical properties despite temperature variations.
2Strength
If adhesive layer is provided between wavelength conversion element and supporting substrate, then bonding strength is improved, but stress concentration at adhesive layer end face causes partial detachments and phase-matched wavelength variation
Solution Approach 1:
The adhesive layer is completely removed from beneath the wavelength conversion element, creating an unbonded region. This extraction eliminates stress concentration at the adhesive layer end face that would otherwise cause partial detachments and phase-matched wavelength shifts.
Solution Approach 2:
The bonding structure is segmented such that only the separate portions are bonded to the supporting substrate, while the wavelength conversion element remains unbonded. This segmentation isolates the conversion element from stress while maintaining overall structural integrity through the bonded separate portions.
3Reliability
If the wavelength conversion element is made as separate body from separate portions, then stress absorption and shielding is improved, but device complexity increases
Solution Approach 1:
The ferroelectric substrate is segmented into a central unbonded conversion element and two bonded separate portions. This segmentation creates a simple stress isolation structure where the separate portions absorb stress while shielding the conversion element, without requiring complex additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly suppresses the intensity drop of wavelength converted light even under extreme temperature variations, maintaining stable performance from -20°C to +80°C.
Implementation Method 1
an adhesive layer bonding said supporting substrate and said wavelength conversion element and bonding said supporting substrate and said separate portions
Implementation Method 2
forming a periodic polarization inversion configuration in these crystals produces a Quasi-Phase-Matched (QPM) Secondary-Harmonic-Generation (SHG) device
Data Source
AI summary
A wavelength conversion device has a supporting substrate, and a wavelength conversion element provided on the supporting substrate, with separate portions provided on both sides of the wavelength conversion element. The separate portions are separated from the wavelength conversion element by an adhesive layer that bonds the supporting substrate and the wavelength conversion element while also bonding the supporting substrate with the separate portions. The element and separate portions are made of ferroelectric materials, respectively. The wavelength conversion element has a ridge optical waveguide, with grooves provided on each or both sides of the ridge optical waveguide and extended portions provided on the outside of each of the grooves.