Wavelength Conversion Support With Through Holes for Heat Dissipation
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Solution Overview
Problem
High-energy laser illumination of fluorescent wheels in projection devices leads to thermal quenching, reducing light conversion capability and shortening the service life of driving devices, especially in high conversion efficiency or small-sized applications.
Innovation Solution
A wavelength conversion device with a support structure between the driver and substrate, featuring through holes for airflow and a connection unit with a higher radial distance from the central axis, enhancing heat dissipation by creating a preferred heat conduction path and reducing heat transfer to the driver.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a fluorescent wheel is used with high-energy laser for wavelength conversion, then light conversion capability is improved, but thermal energy accumulates causing thermal quenching and reducing service life
Solution Approach 1:
The support is divided into multiple segments with through holes, creating a segmented structure that allows heat to be dissipated through multiple pathways rather than accumulating in a solid structure
Solution Approach 2:
The support acts as an intermediary component between the fluorescent wheel and driver, incorporating through holes to facilitate heat dissipation and protect the driver from thermal damage
2Productivity
If the fluorescent wheel operates at high temperature, then light conversion efficiency decreases due to thermal quenching, but increasing cooling may reduce the service life of the driving device
Solution Approach 1:
The support serves as a thermal intermediary that manages heat flow between the fluorescent wheel and driver, using through holes to allow controlled heat dissipation while protecting the driver
Solution Approach 2:
The support structure implements local quality by positioning through holes strategically to allow heat dissipation from critical areas while maintaining structural integrity and protecting the driver
3Volume of moving object
If the support is positioned closer to the substrate for compact design, then device size is reduced, but heat dissipation efficiency decreases
Solution Approach 1:
The solution addresses heat dissipation not just radially but also axially by positioning the support away from the substrate along the rotation axis, creating additional thermal management dimension
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency, reduces overall temperature, and extends the service life of the driver by effectively blocking excessive heat and facilitating airflow to dissipate heat away from the substrate and support.
Implementation Method 1
The support includes at least one through hole... facilitating airflow to dissipate heat away from the substrate and support
Implementation Method 2
The wavelength conversion layer is disposed on the front surface... converts the excitation beam and provides a converted beam
Data Source
AI summary
A wavelength conversion device includes a driver, a substrate and a support. The support is disposed between the driver and the substrate. The support is connected to the substrate and the driver. The driver drives the support and the substrate to rotate about a central axis. The support includes at least one through hole. The invention also provides a projection device including a light source system, the aforementioned wavelength conversion device, a light valve, and a projection lens.