Wavelength Converted LED Leakage Control

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Solution Overview

Problem

Existing wavelength-converted semiconductor light emitting devices on chip-scale packages face issues with leakage of unconverted light from the sides, affecting color-over-angle uniformity and brightness.

Innovation Solution

A semiconductor structure with a light emitting layer is attached to a support, and a wavelength converting material is extended over the sides of the semiconductor structure and support, ensuring mechanical self-support and uniform thickness, replacing traditional reflective materials to prevent side leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-generated harmful factors

If traditional reflective materials are used to prevent side leakage, then light leakage is reduced, but color-over-angle uniformity deteriorates

Engineering Contradiction:
Improveunconverted light leakageVSAvoidcolor-over-angle uniformity
Core Design Contradiction:
Object-generated harmful factorsVSIllumination intensity

Solution Approach 1:

The patent changes the material parameter from reflective material to wavelength converting material, which has different optical properties. The wavelength converting material converts unconverted light to useful light, eliminating leakage while maintaining color uniformity through wavelength transformation rather than reflection

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies color change by using wavelength converting material that transforms the spectrum of unconverted light. This material absorbs unconverted light at certain wavelengths and emits light at different wavelengths, thereby converting harmful leakage into useful light output that maintains color consistency

Inventive Principle:
Principle #32Color changes

2Illumination intensity

If reflective coating is applied over the sides of LED dice, then brightness is improved, but manufacturing complexity increases

Engineering Contradiction:
ImprovebrightnessVSAvoidmanufacturing process complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent merges the wavelength converting function with the light extraction structure by forming a single integrated wavelength converting layer that covers both the top and sides of the LED dice. This eliminates the need for separate reflective coating processes and simplifies manufacturing while maintaining brightness enhancement

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The wavelength converting layer serves multiple functions simultaneously: it converts unconverted light to useful light, acts as a reflective barrier to prevent light leakage, and provides a uniform coating surface. This multi-functionality reduces the number of separate manufacturing steps required

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces or eliminates unconverted light leakage, enhancing color-over-angle uniformity and brightness by using a wavelength converting material that conforms to the semiconductor structure, improving the overall light emission characteristics.

Implementation Method 1

A wavelength converting material extends over the top and sides of the semiconductor structure and the support

Methodology Applied
Scientific EffectWavelength conversion: Photoluminescence

Data Source

PatentUS10868224B2Wavelength converted light emitting device
Publication Date: 2020.12.15 LUMILEDS SINGAPORE PTE LTD
  • US10868224B2 patent drawing
  • US10868224B2 patent drawing
  • US10868224B2 patent drawing

AI summary

Embodiments of the invention include a semiconductor structure comprising a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support, wherein the wavelength converting material has a substantially uniform thickness over the top and sides of the semiconductor structure and the support.