Wavelength Converter Layer Structure for Co-Sintering Adhesion
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Solution Overview
Problem
The inconsistency in softening temperatures between the light-emitting and reflection layers in wavelength conversion devices leads to poor adhesion between the reflection layer and the substrate, causing detachment issues during the co-sintering process.
Innovation Solution
A wavelength conversion device with a light-emitting layer and a reflection layer stacked on a substrate, where the reflection layer comprises smaller glass powder particles that match the softening temperature of the light-emitting layer, enhancing bonding through co-sintering and using specific glass powders and reflection particles for improved adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the inorganic white powder with small particle size is used in the reflection layer, then the reflectivity is improved, but the softening temperature of the reflection layer rises, causing inconsistency with the light-emitting layer and poor adhesion to the substrate
Solution Approach 1:
The patent changes the particle size parameter of the glass powder in the reflection layer to be smaller than that in the light-emitting layer. This parameter change lowers the softening temperature of the reflection layer, making it consistent with the light-emitting layer, thereby ensuring good adhesion to the substrate while maintaining high reflectivity
Solution Approach 2:
The patent uses a composite material system consisting of inorganic white powder and glass powder in the reflection layer. The glass powder acts as a binder that provides adhesion to the substrate, while the inorganic white powder provides reflectivity. The composite structure allows both functions to coexist without compromising either performance
2Strength
If the light-emitting layer and reflection layer are co-sintered to improve bonding, then the bonding between layers is improved, but the inconsistent softening temperatures cause different expansion/contraction degrees, leading to deformation or detachment
Solution Approach 1:
The patent adjusts the particle size parameter of the glass powder in the reflection layer to be smaller than in the light-emitting layer. This change ensures that both layers have consistent softening temperatures during co-sintering, allowing them to expand and contract uniformly, thereby preventing deformation and detachment while achieving strong bonding
Solution Approach 2:
The patent applies different glass powder particle sizes to different layers: larger particle size in the light-emitting layer and smaller particle size in the reflection layer. This local differentiation ensures that each layer has the appropriate softening temperature for its function, while maintaining overall consistency during the co-sintering process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent softening and adhesion between the layers, significantly improving the bonding force between the reflection layer and the substrate, thereby stabilizing the device and enhancing manufacturing efficiency.
Implementation Method 1
the light-emitting layer and the reflection layer are co-sintered in order to obtain a better bonding effect of the two layers
Data Source
Figure 1~2
AI summary
A wavelength conversion device (200), comprising a light-emitting layer (201), a reflection layer (202), and a substrate layer (203) stacked upon each other in that order. The light-emitting layer (201) comprises a wavelength conversion material (2011) and a first glass powder (2012). The reflection layer (202) comprises a reflection particle (2021) and a second glass powder (2022). The second glass powder (2022) has a smaller particle diameter compared to the first glass powder (2022). The technical solution achieves equivalent softening of the reflection layer (202) and light-emitting layer (201) in a sintering process for manufacturing the wavelength conversion device (200), thereby overcoming the issue of inadequate softening of the reflection layer (202) and improving an adhesive strength between the reflection layer (202) and the substrate layer (203).