Wavelength-Converting Wheel Protrusion Thermal Management
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Solution Overview
Problem
Current wavelength-converting wheels in projection apparatuses face issues with heat conductivity, leading to decreased wavelength conversion efficiency and material deterioration due to excessive heat, particularly with the use of conventional heat conductive glues and reflective materials like silicon.
Innovation Solution
A wavelength-converting wheel design featuring a disc with protrusions on its surface, where heat conductive glue is applied between the protrusions and the reflective layer, reducing the overall glue thickness and enhancing heat dissipation by allowing heat to be quickly conducted away from the wavelength-converting and reflective layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat conductive glue is applied to adhere the phosphor layer to the substrate, then adhesion is achieved, but heat conduction decreases sharply with increased glue thickness, affecting wavelength conversion efficiency
Solution Approach 1:
The patent applies local quality by creating protrusions in specific regions of the substrate that concentrate heat conduction pathways in critical areas. The heat conductive glue is strategically positioned on these protrusions rather than uniformly distributed, ensuring optimal thermal management where most needed while minimizing overall glue thickness and its negative thermal effects.
Solution Approach 2:
The substrate surface is segmented into multiple protrusion structures that divide the heat conduction function into discrete localized pathways. This segmentation allows heat to be conducted away through multiple separate channels rather than relying on a continuous thick glue layer, improving overall heat conduction efficiency while maintaining thin glue application.
2Reliability
If the thickness of heat conductive glue is increased to ensure stable adhesion, then adhesion stability improves, but heat conduction decreases, causing material deterioration and damage
Solution Approach 1:
The patent ensures adhesion stability locally at the protrusion regions where heat conduction is most critical. The heat conductive glue is applied specifically on the protrusions rather than uniformly across the entire bonding surface, providing sufficient adhesion at key thermal pathways while minimizing overall glue thickness to maintain heat conduction efficiency.
Solution Approach 2:
The protrusions are pre-formed on the substrate before glue application, creating predetermined heat conduction pathways. This preliminary structural preparation ensures that when glue is applied, it is automatically positioned in optimal locations for both adhesion and thermal management, preventing subsequent material deterioration.
3Temperature
If transparent silicon is used to replace heat conductive glue with thin thickness, then adhesion is maintained, but heat conductivity is insufficient (0.2-0.3 W/(m·K)), resulting in poor wavelength conversion efficiency
Solution Approach 1:
The patent employs composite material strategy by combining heat conductive glue with protrusion structures made of materials having different thermal properties. This composite approach creates a hierarchical thermal management system where the protrusions provide primary heat conduction pathways with high thermal conductivity, while the thin glue layer provides secondary conduction and adhesion, achieving superior overall heat conduction compared to using silicon alone.
Solution Approach 2:
The patent transitions from a two-dimensional uniform glue layer to a three-dimensional protrusion structure. This dimensional change creates vertical heat conduction pathways that reduce the effective thermal resistance path length, allowing heat to escape more efficiently through the protrusions rather than having to conduct through a wide area of low-conductivity material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation, preventing material damage and maintaining high wavelength conversion and reflection efficiencies, while ensuring effective adhesion and thermal conductivity.
Implementation Method 1
the heat conductivity (K) of the heat conductive glue is about 2 W/(m·K) to 10 W/(m·K)... the heat conduction of the heat conductive glue decreases sharply with the increase in the thickness of the heat conductive glue
Implementation Method 2
further arranging a reflective layer, such as a sintered reflective layer, between the sheet-like phosphor layer and the substrate
Implementation Method 3
a part of the blue light of a blue laser diode is usually applied to excite the phosphor powders on the phosphor wheel to generate a yellow light or a green light
Data Source
AI summary
A wavelength-converting wheel has a light incident side. The wavelength-converting wheel includes a disc, a heat conductive glue, a reflective layer, a plurality of protrusions, a heat conductive glue, and a wavelength-converting layer. The disc has an inner ring portion and an annular portion. The annular portion is connected to an outer edge of the inner ring portion. The annular portion includes a protrusion structure region. The protrusions are disposed in the protrusion structure region and protrude toward the light incident side. The heat conductive glue is disposed on the protrusion structure region. The reflective layer is disposed on the heat conductive glue. The wavelength-converting layer is disposed on the reflective layer and has a light receiving surface facing the light incident side.