Wavelength-Converting Layer Clamping for Thermal Detachment Control
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Solution Overview
Problem
In light emitting devices with semiconductor elements, the detachment of the wavelength-converting layer from the heat-dissipating member is a recurring issue due to differences in thermal expansion coefficients, leading to reduced reliability and efficiency.
Innovation Solution
A wavelength-converting member is designed with a thermally conductive part and a fluorescent material-containing part, where the wavelength-converting layer has inclined surfaces that are secured to a heat-dissipating component using a securing member, eliminating the need for adhesives and enhancing heat dissipation by direct contact between the thermally conductive part and the fluorescent material-containing part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to secure the wavelength-converting layer to the heat-dissipating member, then the attachment is simplified, but the reliability decreases due to detachment under thermal stress
Solution Approach 1:
The patent replaces the chemical bonding method (adhesive) with a mechanical securing system consisting of a securing member that physically clamps the wavelength-converting layer to the heat-dissipating member. This mechanical substitution eliminates the reliability issues associated with adhesive detachment under thermal expansion stress while maintaining ease of assembly through the securing member's clamping action.
Solution Approach 2:
The patent employs a composite structure where the securing member integrates multiple functions: it provides mechanical clamping force to prevent detachment, conducts heat away from the wavelength-converting layer, and maintains structural integrity under thermal stress. This composite approach combines materials with different properties (structural strength, thermal conductivity) to simultaneously address both attachment reliability and heat dissipation.
2Ease of manufacture
If adhesive layer is used between wavelength-converting layer and heat-dissipating member, then assembly is easier, but heat dissipation efficiency decreases
Solution Approach 1:
The patent replaces the adhesive layer with a direct mechanical contact system where the securing member applies clamping force to ensure intimate contact between the wavelength-converting layer and heat-dissipating member. This eliminates the thermal resistance introduced by the adhesive layer while maintaining assembly simplicity through the securing member's clamping action.
Solution Approach 2:
The patent extracts and removes the adhesive layer from the structure, eliminating the source of thermal resistance. By taking out the adhesive and replacing it with direct mechanical contact secured by the securing member, the system achieves superior heat dissipation while maintaining ease of assembly through the securing mechanism.
3Ease of manufacture
If conventional securing method is used, then assembly is simple, but detachment occurs under thermal stress
Solution Approach 1:
The securing member is designed as a composite structure that integrates materials with high structural strength to resist thermal expansion stress and high thermal conductivity to dissipate heat. This composite construction allows the simple assembly process to yield a reliable connection that withstands thermal stress without detachment.
Solution Approach 2:
The patent changes the physical parameters of the securing system by introducing a securing member with specific mechanical properties (strength, rigidity) and thermal properties (conductivity). These parameter changes enable the system to maintain simple assembly while achieving high resistance to thermal stress through the securing member's ability to withstand expansion forces and conduct heat away from the interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of detachment, improves heat dissipation, and maintains light extraction efficiency by eliminating the need for adhesives and ensuring reliable attachment of the wavelength-converting layer to the heat-dissipating component.
Implementation Method 1
The wavelength-converting layer includes a thermally conductive part, and a fluorescent material containing part in contact with the thermally conductive part
Implementation Method 2
a fluorescent material containing part in contact with the thermally conductive part
Implementation Method 3
a light source configured to irradiate light to the fluorescent material containing part of the wavelength-converting layer
Data Source
AI summary
A wavelength-converting member includes a wavelength-converting layer, a heat-dissipating component, and a securing member. The wavelength-converting layer has an upper surface, a lower surface, and one or more lateral surfaces with each of the one or more lateral surfaces of the wavelength-converting layer defining an inclined surface inclined at an acute angle with respect to the lower surface of the wavelength-converting layer. The wavelength-converting layer includes a thermally conductive part, and a fluorescent material containing part in contact with the thermally conductive part. The wavelength-converting layer is mounted on the heat-dissipating component. The securing member is secured to the heat-dissipating component. The securing member presses the inclined surface of each of the one or more lateral surfaces such that the wavelength-converting layer is secured to the heat-dissipating component.