Wavy Matrix PCB Component Arrangement for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing printed circuit boards with multiple electronic components connected in series face challenges in compact arrangement, high power density, and efficient cooling due to obstructed conductor tracks, which restricts electrical connectivity and cooling capabilities.
Innovation Solution
A printed circuit board design with electronic components arranged in a wavy matrix pattern, featuring alternating columns and rows, with enlarged contact surfaces for efficient series connection and optimized thermal management, allowing for targeted electrical potential assignment and enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If electronic components are arranged compactly with high power density, then space utilization is improved, but conductor tracks become obstructed and electrical connectivity deteriorates
Solution Approach 1:
The patent divides the circuit board into multiple groups, each containing a series string of electronic components. Within each group, components are arranged in a wavy pattern that segments the conductor tracks into distinct paths, preventing obstruction while maintaining compact spacing. This segmentation allows independent routing of conductor tracks for each component without interference.
Solution Approach 2:
The patent transitions from linear or grid-based component arrangement to a wavy two-dimensional pattern. By introducing lateral displacement in the wavy configuration, the conductor tracks are routed through different spatial dimensions, allowing them to pass between components without being blocked by the compact arrangement.
2Reliability
If conductor tracks are enlarged to avoid obstruction, then electrical connectivity is improved, but the overall circuit board area increases
Solution Approach 1:
The patent applies different conductor track dimensions locally at different positions. Conductor tracks are enlarged only at critical locations where components are closely spaced and obstruction is likely, while maintaining standard track widths in other areas. This localized enlargement minimizes the overall area increase while ensuring connectivity where needed.
3Device complexity
If electronic components are arranged in series to reduce component count, then device complexity is reduced, but cooling capability deteriorates
Solution Approach 1:
The patent segments the series string into multiple groups, each with its own dedicated cooling infrastructure. This segmentation allows thermal management resources to be distributed more effectively across the components, preventing heat accumulation while maintaining the electrical series connection configuration.
Solution Approach 2:
The patent introduces cooling channels or heat dissipation structures as intermediary elements between the electronic components and the surrounding environment. These intermediaries facilitate heat transfer from the compactly arranged series components without disrupting the electrical connectivity or requiring additional component space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables compact, high-power-density component arrangement with efficient cooling and selective switching of individual components, improving both electrical connectivity and thermal management while maintaining a cost-effective production process.
Implementation Method 1
enlarged printed circuit board contact surfaces, so-called contact pads, which are designed to establish an electrical connection with a component and/or to conduct heat from the component to the printed circuit board, downstream heat sink or another adjacent component
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
Printed circuit board (1) having a plurality of electronic components (2, 2', 2'', 2''', 2'''') arranged on the printed circuit board (1) in at least one group (G1, G2, G3), wherein the electronic components (2, 2', 2'', 2''', 2'''') each have a first electrical component contact surface (3') and a second electrical component contact surface (3'') facing the printed circuit board (1), wherein the component contact surfaces (3', 3'') are connected to corresponding printed circuit board contact surfaces (6, 7, 8) arranged on the printed circuit board (1), wherein successive electronic components (2, 2', 2'', 2''', 2'''') form a string by means of a series connection, wherein the string runs in an undulating manner, wherein the electronic components (2, 2', 2'', 2''', 2'''') of the string are arranged on the printed circuit board (1) in accordance with a matrix having at least two rows (Z1, Z2, Z3) and at least two columns (S1, …, S6), and the string runs alternately up and down along columns (S1, …, S6) arranged beside one another.