Wax Base Slow Cooling for Additive Manufacturing Tray Adhesion
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Solution Overview
Problem
Existing additive manufacturing processes face challenges with wax bases on aluminum trays due to thermal and mechanical stresses, leading to disconnection, cracking, and warping, which disrupt the printing process.
Innovation Solution
The method involves slow cooling of wax on the tray surface, using a roughened surface or multiple wax layers with different melting points, and incorporating structural elements like ribs or frames to enhance adhesion and prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a wax base is applied on the aluminum tray to prevent metal-to-metal collision, then the safety and mechanical protection are improved, but thermal stresses cause disconnection and warping of the base from the tray
Solution Approach 1:
A bonding layer is introduced as an intermediary between the aluminum tray and the wax base. This bonding layer has specific material properties that enable it to withstand thermal stresses while maintaining strong adhesion to both the tray and the wax base, preventing disconnection during the printing process
Solution Approach 2:
The thermal parameters of the bonding layer are specifically controlled to match the thermal expansion and stress characteristics of both the aluminum tray and the wax base. This parameter matching reduces thermal stress differential and prevents warping and disconnection
2Area of stationary object
If the wax base is made thick to ensure adequate coverage and protection, then the protective function is improved, but the build quality deteriorates due to cracking and warping
Solution Approach 1:
The base structure is segmented into multiple functional layers: a bonding layer attached to the tray, and a wax base layer on top. This segmentation allows each layer to be optimized independently - the bonding layer provides attachment and stress resistance, while the wax base provides coverage and protection, eliminating cracking and warping issues
3Strength
If the wax base is heated to melt surface wax for better adhesion, then the bonding strength is improved, but the process complexity increases due to temperature control requirements
Solution Approach 1:
The bonding layer is designed with specific material parameters including controlled melting point and thermal conductivity. These parameters are selected to enable adhesion enhancement through heating while maintaining processability, reducing the complexity of temperature control requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach strengthens the bond between the wax base and the tray, reducing the risk of disconnection and improving the build quality and efficiency of the additive manufacturing process.
Implementation Method 1
placing a layer of wax on a surface of said printing tray, said wax being heated to above a melting point thereof such that wax in contact with said tray is molten
Implementation Method 2
Slowly cooling said wax while continually pressing on said wax, therewith to form said base
Data Source
AI summary
A method of forming a base for additive manufacture in order to print an object or part object on the wax base involves forming the wax base on a printing tray. The base is constructed by providing a layer of wax on a surface of said printing tray. The wax is heated to above a melting point thereof so that the wax in contact with the tray is molten, and then the wax is slowly cooled while continually pressing on the wax. The slow cooling ensures a bond between the wax and the printing tray which may be enhanced if the tray surface is roughened.