WBGA Package Structure With Through-Hole Routing for High-Frequency Signals

The patent extracts the wire-bonding process from the electrical connection method and replaces it with a direct conductive trace connection through the substrate. The conductive trace extends from the first surface through the substrate to the second surface, eliminating the need for wire bonding and enabling direct electrical connection that supports high-frequency signals while maintaining cost-effectiveness.

The patent replaces the mechanical wire-bonding process with an integrated conductive trace system embedded in the substrate. Instead of using separate wire bonds to create electrical connections, the substrate itself contains conductive traces that provide direct electrical pathways, substituting a mechanical assembly process with an integrated structural solution.

The patent merges the electrical connection function with the substrate structure itself. The conductive trace is integrated into the substrate, extending continuously from the first surface through to the second surface. This eliminates the need for separate wire-bonding interfaces and vertical connection structures, combining multiple functions into a single integrated component.

The substrate serves multiple functions: it provides mechanical support, contains the optical waveguide for light transmission, and incorporates the conductive trace for electrical connection. This multi-functional design eliminates the need for separate components and interfaces that would be required in conventional wire-bonding approaches.