Wearable Device Annular Body Package Embedding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing virtual reality controllers are bulky and heavy, limiting user nimbleness and convenience during hands-free operation.
Innovation Solution
A wearable device with an annular body and a package body, where the electronic component is embedded in the package material and assembled into the annular body with an assembly gap, minimizing volume and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the controller uses traditional bulky design to accommodate electronic components, then the reliability and functionality are improved, but the weight and volume increase, reducing user nimbleness
Solution Approach 1:
The patent embeds electronic components directly into the package material structure, creating a nested configuration where components are housed within the material matrix itself rather than requiring separate bulky housings. This nesting approach reduces overall volume and weight while maintaining functional reliability.
Solution Approach 2:
The patent employs composite materials that integrate multiple functions into a single structure. The package material serves both as structural housing and as the embedding medium for electronic components, creating a composite structure that reduces weight and volume compared to traditional separate-component designs.
2Reliability
If the controller uses traditional bulky design to accommodate electronic components, then the reliability and functionality are improved, but the volume increases, reducing user nimbleness
Solution Approach 1:
The patent embeds electronic components directly into the package material structure, creating a nested configuration where components are housed within the material matrix itself rather than requiring separate bulky housings. This nesting approach reduces overall volume and weight while maintaining functional reliability.
Solution Approach 2:
The patent merges the housing structure and component mounting function into a single integrated package material. This consolidation eliminates the need for separate structural housings and component shields, reducing overall volume while maintaining protective and functional requirements.
3Strength
If the package material is cured completely to ensure structural integrity, then the strength is improved, but the manufacturing complexity increases due to precise removal requirements
Solution Approach 1:
The patent performs preliminary shaping and positioning of electronic components within the uncured package material before curing. This preliminary action allows for easier subsequent processing and reduces the complexity of post-curing operations, as components are already in their final positions and the structure is being formed rather than requiring complex assembly after curing.
Solution Approach 2:
The patent segments the package material into functional regions with different curing characteristics or removal requirements. This segmentation allows selective curing and removal in different areas, simplifying the overall manufacturing process by enabling localized control rather than requiring complete curing and uniform removal throughout the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wearable device achieves reduced volume and weight, enhancing operational nimbleness and convenience, while maintaining a good waterproof effect.
Implementation Method 1
The package material is cured
Data Source
AI summary
A wearable device and a manufacturing method thereof are provided. The wearable device includes an annular body and a package body. The annular body has an inner chamber. The package body is assembled into the inner chamber. There is an assembly gap between the package body and a chamber wall of the inner chamber. The package body includes a package material and an electronic component. The electronic component is embedded in the package material and closely combined with each other.


