Wearable Antenna Feed Assembly With Nested Grounding Layout
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Solution Overview
Problem
Existing wearable electronic devices face challenges in maximizing performance due to the limitations imposed by the arrangement and inclusion of multiple components, which can compromise the functionality and efficiency of individual components.
Innovation Solution
A portable electronic device design that incorporates a device housing with an internal volume, an electronic component with a component housing, and an antenna feed assembly. The antenna feed assembly includes a conductive grounding component surrounding the component housing and an antenna feed component connected to the grounding component, allowing for adjustable grounding and selective frequency driving.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are included in the device to enhance functionality, then the device performance is improved, but the device size increases and portability is compromised
Solution Approach 1:
The antenna feed assembly is nested within the electronic component housing, with the conductive grounding component at least partially surrounding the component housing. This nested arrangement allows multiple functional elements (antenna feed, grounding, electronic component) to occupy overlapping spatial volumes, reducing the overall device volume while maintaining all required functionalities.
Solution Approach 2:
The grounding component serves dual functions: it provides electrical grounding for the antenna feed assembly and simultaneously acts as a structural support element. Additionally, the antenna feed assembly integrates both the feed component and grounding component into a single integrated unit, reducing the number of separate parts and overall device volume.
2Adaptability or versatility
If multiple components are arranged in the device to enhance functionality, then the device performance is improved, but the component performance is limited due to space constraints
Solution Approach 1:
The conductive grounding component is positioned to at least partially surround the component housing, creating a localized grounding environment specifically for the antenna feed assembly. This localized arrangement ensures optimal grounding performance for the antenna while allowing other components in the device to maintain their own performance characteristics without interference.
3Volume of moving object
If the device size is reduced to enhance portability, then the device volume is decreased, but the antenna efficiency is compromised
Solution Approach 1:
By nesting the antenna feed assembly within the electronic component housing and surrounding it with the grounding component, the design achieves compact volume while maintaining adequate space for the antenna elements to function efficiently. The nested structure allows the antenna to maintain its required dimensions for efficient operation within the reduced overall device volume.
Solution Approach 2:
The adjustable grounding component can be repositioned to optimize antenna performance at different frequencies. This dynamic adjustment capability allows the antenna system to maintain high efficiency across multiple frequency bands despite the compact device size, as the grounding configuration can be tuned to match the operational requirements of the antenna.
Data Source
AI summary
A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.