Wearable Antenna Layout Using SiP Substrate to Cut Path Loss
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Solution Overview
Problem
Wearable electronic devices, such as TWS wireless earphones, face challenges with limited antenna area due to miniaturization, leading to reduced antenna performance and deteriorated data transmission and sound quality.
Innovation Solution
The integration of an antenna pattern on both an antenna carrier and a semiconductor packaging substrate (SiP substrate) increases the overall antenna area and improves performance by separating the RF port of the main IC and antenna area, mitigating path loss and noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the antenna pattern is disposed only on the antenna carrier to simplify the structure, then the device complexity is reduced, but the antenna area becomes small resulting in low antenna performance
Solution Approach 1:
The patent merges the antenna pattern with the semiconductor packaging substrate by disposing the antenna pattern on both the antenna carrier and the semiconductor packaging substrate. This combination increases the effective antenna area while maintaining structural integration, thereby improving antenna performance without significantly increasing device complexity
Solution Approach 2:
The patent utilizes the surface of the semiconductor packaging substrate as an additional dimension for antenna placement. By extending the antenna pattern from the traditional antenna carrier to include the packaging substrate surface, the effective antenna area is expanded in a new spatial dimension
2Volume of moving object
If the unit size is miniaturized to improve wearing comfort, then the wearable comfort is improved, but the antenna area becomes limited resulting in reduced antenna performance
Solution Approach 1:
The patent compensates for the limited antenna area in miniaturized devices by utilizing the packaging substrate surface as an additional antenna placement area. This dimensional expansion allows sufficient antenna area to be achieved within the constrained volume of miniaturized wearable devices
Solution Approach 2:
The semiconductor packaging substrate serves dual functions: it packages the electronic components and simultaneously provides an additional area for the antenna pattern. This multi-functionality allows the same substrate to contribute to both device miniaturization and antenna performance
3Object-affected harmful factors
If conformal metal shielding is disposed to remove noise when the antenna is close to the human body, then the noise interference is reduced, but the RF performance deteriorates
Solution Approach 1:
The patent extracts the harmful interaction between the antenna and human body by increasing the antenna area and distributing the antenna pattern across multiple surfaces. This spatial distribution reduces the concentration of electromagnetic fields near the body, thereby reducing noise interference without requiring aggressive metal shielding that would degrade RF performance
4Device complexity
If a semiconductor packaging substrate is applied to dispose various electronic components in limited space, then the device integration is improved, but the RF port and antenna area are separated by long distance causing path loss
Solution Approach 1:
The patent merges the antenna pattern with the semiconductor packaging substrate, creating a direct electrical connection between the RF port on the substrate and the antenna pattern on the same substrate. This integration eliminates the long-distance separation and associated path loss while maintaining the benefits of component integration
Data Source
AI summary
A wearable electronic device is provided. The wearable electronic device includes a first antenna structure disposed on an antenna carrier, a printed circuit board, a semiconductor packaging substrate packaged with the printed circuit board, a second antenna structure disposed on at least a portion of a surface of the semiconductor packaging substrate, and a contact structure electrically connecting the first antenna structure and the second antenna structure.