Wearable Computing Module With Multi-Face Interface Connector
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Solution Overview
Problem
There is a need for wearable computing devices that balance compact size, functionality, and user configurability while providing wireless communication, cloud access, and media playback capabilities, with a focus on adaptability to various carriers and user preferences.
Innovation Solution
A wearable computing module design featuring a compact case with an optical display subsystem, a circuit element assembly, and a power cell, integrated with a carrier system that includes engagement features for secure and customizable attachment, allowing the module to be easily coupled to different carriers and supporting various communication protocols.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the wearable computing module is designed with multiple functional components (optical display subsystem, circuit element assembly, power cell), then the functionality and versatility are improved, but the device complexity and size increase
Solution Approach 1:
The patent combines multiple functional components (optical display subsystem, circuit element assembly, power cell, interface connector) into a single integrated wearable computing module housed within one enclosure. This merging approach enables the device to provide comprehensive functionality (display, computing, power management, wireless communication) while maintaining a compact form factor suitable for wearable applications.
Solution Approach 2:
The wearable computing module is designed with multi-functional capabilities including optical display, wireless communication, cloud access, local and remote storage, media playing, and application processing. The interface connector supports multiple connection types (side openings and bottom openings) to accommodate various carriers and usage scenarios, enhancing the device's adaptability and versatility.
2Volume of moving object
If the device size is reduced to meet wearable requirements, then the portability is improved, but the available space for functional components is reduced
Solution Approach 1:
The patent employs a nested arrangement where the circuit element assembly and power cell are positioned within the enclosure defined by the case, with the optical display subsystem coupled to the case. The interface connector is integrated into the case structure with openings on multiple faces. This nesting approach maximizes the utilization of internal space, allowing multiple functional components to be accommodated in a compact wearable form factor.
Solution Approach 2:
The interface connector is designed with openings on multiple faces (side openings on lateral sidewalls and bottom openings on the bottom portion), utilizing three-dimensional space efficiently. This multi-dimensional approach to component arrangement allows for versatile connectivity options without increasing the device's overall footprint, maintaining portability while enhancing functionality.
3Adaptability or versatility
If multiple interface openings are provided for carrier connectivity, then the adaptability to various carriers is improved, but the manufacturing complexity increases
Solution Approach 1:
The interface connector is segmented into multiple openings located on different faces of the case (side openings on lateral sidewalls, bottom openings on the bottom portion). Each opening can be independently configured to accommodate different carrier types and connection requirements. This segmentation allows the device to adapt to various carriers while maintaining a modular design that can be manufactured using standard fabrication processes for each opening type.
Data Source
AI summary
In an example embodiment, a computing module includes a case, an optical display subsystem coupled to the case, a circuit element assembly, a power cell and an interface connector. The case includes a bottom portion and multiple lateral sidewalls. The case defines an enclosure. The circuit element assembly is positioned within the enclosure and is coupled to the optical display subsystem. The power cell is coupled to the circuit element assembly. The interface connector is defined in the case and includes multiple side openings, multiple bottom openings and multiple connector pads. The side openings are defined in at least one of the lateral sidewalls. The bottom openings are defined in the bottom portion of the case. The connector pads include multiple side pads coupled to the case and in communication with the side openings and multiple bottom pads coupled to the case and in communication with the bottom openings.