Wearable Display Thermal Management via Circuit Board Positioning
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Solution Overview
Problem
Existing wearable display devices with built-in organic EL elements face challenges in heat dissipation, particularly when other heat-generating components are present, leading to potential performance deterioration and reduced operational life due to insufficient consideration for heat management beyond the display panel.
Innovation Solution
The wearable display device incorporates a first and second circuit board with different calorific values, where the second circuit board with higher heat generation is positioned on the outer side of the packaging case, and a heat dissipation sheet efficiently transfers heat from the display element to the outer packaging case, which is made of a high-heat-conductivity material like magnesium alloy, facilitating effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation sheet is provided to dissipate heat from display panel to housing, then heat dissipation from display panel is efficiently achieved, but heat from other heat generating elements is not adequately managed
Solution Approach 1:
The patent applies local quality by differentiating heat dissipation approaches for different heat-generating components. The display panel receives dedicated heat dissipation through a heat dissipation sheet, while circuit boards are positioned according to their specific calorific values - high-calorific circuit boards on the outer surface and low-calorific ones inside the housing. This localized, component-specific heat management strategy resolves the contradiction by ensuring each heat source is managed appropriately for its thermal characteristics.
2Device complexity
If circuit boards are disposed inside the housing, then device structure is compact, but temperature increase occurs due to insufficient heat dissipation
Solution Approach 1:
The patent applies parameter changes by varying the positional parameter of circuit boards based on their calorific value parameter. High-calorific circuit boards are positioned on the outer surface where heat dissipation is more effective, while low-calorific circuit boards are placed inside the housing. This parameter-based positioning strategy maintains structural compactness while preventing temperature increase through optimized thermal management.
3Volume of moving object
If multiple heat generating elements are disposed in limited space, then device is compact, but heat accumulation occurs leading to performance deterioration
Solution Approach 1:
The patent applies asymmetry by creating an asymmetric thermal management architecture where different types of heat-generating elements are positioned asymmetrically within the housing. Rather than uniform distribution, high-calorific circuit boards are placed on the outer surface while low-calorific ones are positioned inside, creating an asymmetric layout that optimizes heat dissipation pathways and prevents heat accumulation in the limited device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature increases within the device, enhances heat dissipation, and maintains performance while extending the operational life of the display element by strategically managing heat from both the display and circuit boards.
Implementation Method 1
a heat dissipation sheet efficiently transfers heat from the display element to the outer packaging case
Implementation Method 2
the outer packaging case, which is made of a high-heat-conductivity material like magnesium alloy, facilitating effective cooling
Data Source
AI summary
A wearable display device includes a display element, a first circuit board, a second circuit board, and an outer packaging case housing the display element, the first circuit board, and the second circuit board, wherein the second circuit board has a larger calorific value than the first circuit board, and is disposed at a further outer side, which is an opposite to a wearer than the first circuit board, in the outer packaging case.