Wearable Display Circuit Distribution for Heat Dissipation
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Solution Overview
Problem
Portable wearable displays face challenges with increasing processing unit loads, leading to enlarged dimensions and heat radiation issues due to the accumulation of electric circuits, particularly in headphones or retaining units.
Innovation Solution
The solution involves distributing circuit boards and processing units across multiple portions of the wearable display, including separate fixing units, a coupling unit, and headphones, with strategic placement and thermal management using materials with high thermal conductivity and radiation performance to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If processing units and electric circuits are collectively accommodated in one headphone to simplify electric wiring distribution, then device complexity is reduced, but the dimensions of the headphone are enlarged and heat radiation becomes insufficient
Solution Approach 1:
The patent divides the processing units and electric circuits into multiple separate circuit boards distributed across different portions of the wearable display system. Instead of consolidating all circuits in one headphone, the system separates them into: (1) a first circuit board in one headphone containing audio processing circuits, (2) a second circuit board in another portion containing display control circuits, and (3) a third circuit board in a retaining unit containing power supply circuits. This segmentation reduces the volume of each individual component while maintaining wiring simplicity through modular design.
Solution Approach 2:
The patent transitions from a single-point accommodation approach (all circuits in one headphone) to a distributed spatial arrangement across multiple dimensions of the wearable display system. Circuit boards are placed in different spatial locations including headphones, retaining units, and coupling structures, utilizing the three-dimensional space available in the wearable display architecture to optimize both volume distribution and heat radiation surface area.
2Device complexity
If processing units and electric circuits are collectively accommodated in one headphone, then device complexity is reduced, but heat radiation becomes insufficient due to concentrated heat generation
Solution Approach 1:
The patent segments heat-generating processing units and electric circuits into multiple separate circuit boards located in different portions of the wearable display. This spatial separation of heat sources prevents heat concentration in one location, allowing each circuit board to dissipate heat more effectively to its surrounding environment, thereby improving overall heat radiation capability while maintaining simplified wiring through modular circuit distribution.
Solution Approach 2:
The patent extracts heat-generating electric circuits from a single concentrated location (one headphone) and redistributes them to multiple separate locations throughout the wearable display system. This extraction and redistribution of heat sources to dispersed locations enhances the system's overall heat radiation efficiency by providing multiple heat dissipation pathways and preventing thermal accumulation in any single area.
3Device complexity
If all electric circuits are accommodated in a retaining unit, then device complexity is reduced, but the dimensions of the retaining unit are enlarged
Solution Approach 1:
The patent segments the accommodation of electric circuits by placing different circuit boards in different structural components of the wearable display. Instead of housing all circuits in the retaining unit, the system distributes: audio processing circuits in headphones, display control circuits in coupling structures or other headphones, and power supply circuits in the retaining unit. This segmentation allows the retaining unit to maintain a compact size while the overall system achieves simplified circuit accommodation through coordinated distribution across multiple components.
4Device complexity
If all electric circuits are accommodated in a retaining unit, then device complexity is reduced, but temperature of the retaining unit is raised due to heat generation
Solution Approach 1:
The patent segments heat-generating electric circuits into multiple separate circuit boards distributed across different structural components. By placing only power supply circuits (which generate less heat compared to processing units) in the retaining unit, while locating high heat-generating processing circuits in headphones and coupling structures, the system reduces the thermal load on the retaining unit. This segmentation maintains simplified circuit accommodation while preventing excessive temperature rise in the retaining unit through strategic thermal load distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the overall dimensions of the retaining units while effectively managing heat radiation, preventing temperature rises and maintaining efficient operation of the wearable display.
Implementation Method 1
the separately provided circuit boards are disposed at functionally optimum positions
Implementation Method 2
heat generated by the circuits cannot sufficiently be radiated
Data Source
AI summary
A headphone includes a pad which is brought into contact with a human head, an enclosure which outputs an audio, and a dome as means for adjusting quality of the audio output by resonating or absorbing the sound wave emitted from the enclosure. The dome has no parts other than those used for absorbing and reflecting audio and is almost hollow. In the dome is arranged a circuit substrate by using a circuit support part having a shape not blocking the air flowing in the dome. Such a circuit substrate is also built in the other headphone. The circuit substrates arranged in the dome of the headphone are connected by a cable arranged inside a head band or an FPC for transmission of a signal and power supply. Thus, it is possible to provide an output device which can solve the problem of the dimensions for containing operation processing devices and the problem of heat dissipation.