Wearable Electronic Device Sphere Assembly Method
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Solution Overview
Problem
Wearable electronic devices, such as enhanced prayer beads, lack integration of daily and business-related functions, limiting their functionality and user interaction beyond religious rituals.
Innovation Solution
A wearable electronic device with a mobile payment function, incorporating a main sphere and secondary spheres, featuring a wireless transmitting component and chip for inductive payment, and a simplified assembling method suitable for mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components (chip, wireless transmitting component) are integrated into the main sphere to enable mobile payment function, then the functionality and versatility of the wearable device is improved, but the device complexity and assembly difficulty increase
Solution Approach 1:
The main sphere is divided into an upper cover and a lower cover, creating separate assembly spaces for different components. The chip and wireless transmitting component are placed in the first assembling space, while the button component is placed in the second assembling space, allowing independent assembly and reducing overall complexity
Solution Approach 2:
The threading pillar is clamped between the upper and lower covers, with through holes passing through both covers and the pillar. This nested structure allows multiple components to be integrated through a single clamping action, simplifying the assembly process while maintaining functional integration
2Ease of operation
If the main sphere size is constrained (9-15mm outer diameter) to maintain wearability, then the ease of operation is improved, but the space for integrating electronic components is limited
Solution Approach 1:
The design utilizes the vertical dimension by creating through holes that pass through both the upper and lower covers, allowing the threading pillar to extend across the entire sphere. This vertical integration maximizes space utilization within the constrained diameter, enabling component placement along the z-axis rather than only in the radial plane
Solution Approach 2:
Multiple functional components are nested within the compact main sphere structure. The chip and wireless transmitting component are housed in the first assembling space, the button component is in the second assembling space, and the threading pillar with through holes provides structural integration, allowing maximum functionality within the 9-15mm diameter constraint
3Productivity
If a simplified assembly method is used to improve productivity and product yield, then the manufacturing efficiency is improved, but the manufacturing precision may be compromised
Solution Approach 1:
The threading pillar is pre-formed with through holes that align with corresponding holes in the upper and lower covers. This preliminary preparation allows the pillar to be clamped between the covers in a single action, establishing precise positioning for all components without requiring complex alignment procedures during assembly
Solution Approach 2:
The clamping structure creates a nested arrangement where the threading pillar is secured between the upper and lower covers, with all components (chip, wireless transmitting component, button) positioned relative to this central pillar. This single clamping action simultaneously secures multiple components in their correct positions, maintaining precision while simplifying the assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the integration of mobile payment functionality while simplifying the assembly process, improving product yield and user convenience by integrating electronic components within a compact design.
Implementation Method 1
a wireless transmitting component, and the wireless transmitting component is electrically connected to the chip
Data Source
AI summary
A wearable electronic device includes a plurality of secondary spheres and a main sphere connected in series. The main sphere includes a lower cover, an upper cover, a threading pillar, a chip, and a wireless transmitting component. The lower cover has a first assembling space. The upper cover is disposed on the lower cover and covers the first assembling space. The upper cover has a second assembling space communicated with the first assembling space. The threading pillar is clamped between the lower cover and the upper cover and is located in the first assembling space and the second assembling space. Both of the chip and the wireless transmitting component are disposed in the first assembling space, and the wireless transmitting component is electrically connected to the chip. An assembling method of a wearable electronic device is also provided.